AEMCSE 2025 The 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from April 25-27, 2025. This conference aims to provide a platform for scholars, researchers, and industry professionals worldwide to exchange the latest research findings and explore development trends. The conference will cover various fields, including but not limited to the design and application of advanced electronic materials, new developments in computer science, best practices in software engineering, innovative applications of artificial intelligence technologies, and information security. Renowned international experts will be invited to deliver keynote speeches, and multiple parallel sessions will be organized to facilitate in-depth discussions and collaborations among participants. AEMCSE 2025 offers valuable opportunities for participants to share research results, discuss technological challenges, and establish cooperative relationships. We sincerely invite experts and scholars from related fields to visit Nanjing and jointly promote the progress and innovation in electronic materials, computer science, and software engineering. |
The 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) serves as good platforms for academics, researchers, and engineers to meet and exchange innovative ideas and information on all aspects of Advanced Electronic Materials, Computers and Software Engineering. We are delighted to invite you to participate in AEMCSE 2025.
The topics of interest for submission include, but are not limited to:
Advanced Electronic Materials
· Nanomaterials and Nanotechnology · Semiconductor Materials and Devices · Electronic Packaging and Interconnection Technology · Flexible electronics and smart wearable devices · High Frequency Electronic Materials and Applications · Electronic ceramics and catalytic materials · Photoelectric materials and LED technology · Thermoelectric materials and thermal management · technologyBattery Technology and Energy Storage · New display technology and materials · Optoelectronics and Microelectronic Materials · Optoelectronic display materials · Semiconductor Materials and Semiconductor Lighting · Power Laser Materials and Devices · Advanced Packaging Materials and Technologies · Solar cell materials · Electromagnetic Compatibility Technology and Materials · Materials and Devices for High Frequency and Ultra High Frequency Communication
|
Computers Engineering
· High Performance Computing and Optimization · Computer system and architecture design · Cybersecurity and Privacy Protection · Artificial Intelligence and Machine Learning System· sQuantum Computer and ApplicationsEmbedded System and Internet of Things · Data Center Technology · Computer Vision and Graphics · Algorithm Design and Complexity · Signal processing · Communication and wireless networks · Optical communication · Information Security · Computer Networks and Distributed Computing · Embedded system · Integrated circuit · Optoelectronic devices |
Software Engineering
· Software Testing and Quality Assurance · Continuous Integration and Continuous Deployment · Software Architecture and Design Patterns · Cloud Computing and Service-oriented Architecture · Mobile Application Development and Platform · User interface Design and User Experience · Software Project Management and Agile Development · DevOps Culture and Automation Tools · Software design method · Software testing technology · Component-based software engineering · Computer-supported collaborative work · Programming language · Multimedia technology application · Embedded software and applications · Computer Graphics and Human Machine Interaction · Computer Aided Design |
Apr 25
2025
Apr 27
2025
Draft paper submission deadline
Registration deadline
Submit Comment