2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

We are waiting for your abstract submission.
Call for Papers flyer: Download
ICEP 2025 abstract template and detail instructions: Download

The abstract submission deadline is October 31, 2024.
The abstract deadline has been extended until November 7, 2024.

We would like to ask you to prepare an abstract using the template. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. You must include the novel, original, and unpublished contents and state the purposes, methods, results, and conclusions clearly in the abstract.

Thank you very much for your contribution!

Major Topics

Advanced Packaging
  -2.xD/3D, TSV/TGV
  -Substrates/interposers/RDL
  -Fan-out/in packaging
  -Wafer/panel level packaging
  -Automotive and IoT applications
  -High-performance computing
  -Heterogeneous integration technologies
  -Chiplet packaging
  -Hybrid bonding
  -Other related technologies
Emerging Technologies
  -Health/medical care and cosmetics devices
  -Stretchable/flexible electronics
  -Sensor and MEMS/NEMS/MOEMS packaging
  -Batteries and eco-friendly devices
  -Advanced MEMS/NEMS/MOEMS technologies
  -Packaging for quantum computing
  -Other related technologies
High-Speed, Wireless & Components
  -3D-printed components
  -Antennas, RFs, and sensor modules
  -Highspeed applications (5G, LTE etc.)
  -Automotive and IoT applications
  -Other related technologies
Power Electronics
  -Power device and module fabrication (HEMT, diode, IPM etc.)
  -Advanced Inverter & converter
  -Super capacitor
  -Harsh environment tolerant device & module
  -Si-based MOSFET, BJT, IGBT
  -Other relating technologies
Thermal Management
  -Advanced cooling technologies
  -Thermal management structures (heat sinks, pipes, etc.)
  -Simulation, measurement, and evaluation methods
  -Other related technologies
Interconnections
  -Interconnection methods (flip-chip, wire-bonding etc.)
  -2.xD/3D, TSV/TGV, fan-out/in interconnections
  -Embedded systems
  -Power electronics interconnections
  -Bio/medical and eco-friendly devices
  -Hybrid bonding
  -Other related technologies
Materials and Processes
  -Homo/heterogeneous bonding/assembly
  -Substrates, interposers and panels
  -Metallic materials & processes (plating, soldering etc.)
  -Organic semiconductors (OLED, OFET, OPV etc.)
  -Power electronic/battery materials & processes
  -Optoelectronic materials & processes
  -Additive manufacturing (compound, paste, 3D printing etc.)
  -Die to Wafer, Wafer to Wafer, Debonding
  -Other related technologies
Design, Modeling, and Reliability
  -2.xD/3D, TSV/TGV, WLCSP, Fan-out/in
  -Advanced reliability evaluation (PDfR etc.)
  -High performance board design
  -Novel test methods and life models (LCA, TCAD etc.)
  -Other related technologies
Optoelectronics
  -3D/silicon photonics technologies
  -Optical connectors, waveguides, & transceivers
  -Device fabrication (LED, laser, sensor, etc.)
  -Mid/on-board module fabrication
  -Optical wafer/chip-scale packaging
  -Co-packaged optics
  -Other related technologies
Other Upcoming Technologies
  -New system concept & design
  -Any other topics related to ICEP scope