Introduction

2025 IEEE 16th International Conference on ASIC (ASICON 2025) will be held in Kunming, China, during Oct. 21-24, 2025. The conference is intended to provide an international forum for Integrated circuit designers, ASIC users, system integrators, IC manufacturers, process and device engineers, and CAD/CAE tool developers to present their latest progress, development and research results in their respective fields. The four-day event features keynote speeches, invited talks, regular paper presentations and tutorials, delivered by leading experts in the respective fields, on state-of-the-art Integrated circuits, design methodologies, devices, processes and manufacturing technologies. The Excellent Student Paper Award & Outstanding Young Scholar Paper Award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/testing facilities, and novel ASIC products will be held during the conference.

Committee
General Co-Chairs
  • Jan Van der Spiegel
  • Hao Min
  • Bin Zhao
  • Yong Lian
  • Kun Yue

 

  Steering Committee Co-Chairs
  • Jan Van der Spiegel
  • Mengqi Zhou
  • Ting-Ao Tang
Advisory Committee Co-Chairs
  • Chenming Hu
  • Hiroshi Iwai
  • Cor Claeys
  • Qianling Zhang
  Program Committee Co-Chairs
  • Fan Ye
  • Na Yan
  • Francois Rivet
  • Haruo Kobayashi
  • Jyi-Tsong Lin
  • Yimao Cai
  • Huaqiang Wu
  • Yi Zhao
  • Hao Xu

 

Organizing Committee Co-Chairs
  • Huihua Yu
  • Lixing Yu
  Publicity Co-Chairs
  • Wei Xu
  • Rui Yiu
  • Jiting Sheng

 

Publicity Chair

  • Mengqi Zhou
 

Secretary-General

  • Fan Ye
Call for paper

Important date

2025-06-30
Draft paper submission deadline
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Important Date
  • Conference Date

    Oct 21

    2025

    to

    Oct 24

    2025

  • Jun 30 2025

    Draft paper submission deadline

  • Oct 24 2025

    Registration deadline

Sponsored By
Fudan University
Organized By
Fudan University