WELCOME TO CMSEC 2025

International Conference on Material Science and Electronics Circuit (CMSEC) will be held in ​April 25-28, 2025 in Wuhan, China. CMSEC will focus on research areas such as electronic circuits and materials science. The conference aims to provide a platform for experts, scholars, engineers, and technical R&D personnel engaged in electronic circuit and materials science research to share scientific research results and cutting-edge technologies, understand academic development trends, broaden research ideas, strengthen academic research and discussion, and promote academic achievement transformation and cooperation. The conference sincerely invites experts, scholars, business people and other relevant personnel from domestic and foreign universities and research institutions to attend the conference and exchange ideas.

CALL FOR PAPERS

International Conference on Material Science and Electronics Circuit (CMSEC) sincerely welcome experts, scholars to submit papers:

Design and Synthesis of Biomaterials
Biomimetic Engineering and Smart Materials
Biodegradable and Eco-friendly Materials
Clean Energy Materials
Electrocatalytic and Photocatalytic Materials
Thermoelectric Materials for Energy Harvesting
Environmental Remediation Materials
Advanced Semiconductor Materials
Flexible Electronics and Wearable Devices
Photoelectric Conversion Materials
Nonlinear Optical and Photonic Crystal Materials
Spintronic and Quantum Materials
Dielectric and Piezoelectric Materials
Nanomaterials for Energy Applications
Nanobiotechnology

Nanocomposites
Nanomechanics and Nanomanufacturings
Analog / Mixed-Signal /RF Circuits
Bio-Medical and Bio-Inspired Circuits and Systems
Circuits and Systems for Al algorithms
EDA,Test and Reliability
Digital Circuits and Systems
Energy Harvesting and Power Management
Linear and Non-Linear Circuits and Systems
Low-Power and Low-Voltage Design
Neural Networks, Machine and Deep Learning
Microsystems and embedded systems
Sensors and Sensing Systems
Signal Processing, lmage and Video
VLSI Systems and Applications

Scope:  The Subject Areas include, but are not limited to:
Ø Nanomedical materials in drug delivery and drug release, gene and immune therapy nanostructured coatings for enhanced adhesive, anti-bacterial, anti-viral properties, and anti-fouling properties.
Ø Regenerative biomaterials, materials with engineered interfaces, self-assembled materials, materials with selective mechanical and functional properties, and multi-scale scaffolds for tissue engineering and thrombogenic control, and dental materials for soft and hard tissue reconstruction and regeneration.
Ø 3D/4D printing for bioactive materials.
Ø Theoretical (In-Silico) Biomaterials modeling, design, and AI applications.
Ø Submission deadline: Ongoing ( APC fully waived by the end of 2025)

Why Publish with Us
Ø Fully Open Access publishing with NO article processing charges.
Ø Targeted JIF ≥ 8.
Ø An efficient review process with an average turnaround time of ≤30 days from submission to the first decision.
Ø Constructive, professional feedback from a dedicated peer review team.
Ø Global visibility and accessibility to ensure the widest possible dissemination of your work, EurekAlert , twitter , linkedin , facebook et al.