Event-Augmented SEMPO for High-Accuracy Bearing Fault Diagnosis
ID:96 View Protection:ATTENDEE Updated Time:2026-09-26 00:26:26 Hits:2 Oral Presentation

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Abstract
This paper adapts the lightweight time-series foundation model SEMPO to three-class bearing fault diagnosis using the Paderborn University dataset. The method combines a low-rate SEMPO pathway with a full-rate multiscale event encoder and partition-restricted aggregation of three adjacent windows. The SEMPO pathway retains reversible normalization, FFT-based energy decomposition, multi-frequency views, patch embedding, encoder, domain mixture-of-experts and prefix modules, and decoder statistical pooling. The event pathway uses parallel convolutional kernels of 7, 31, and 127 samples to capture local impulses and oscillatory bursts that may be attenuated by downsampling. Evaluation uses class-stratified random window sampling at the N15_M07_F10 operating point, with 64%/16%/20% train/validation/test partitions and three independent seeds. The complete EventAggFocalMarginSupCon model achieves 98.16% accuracy and 98.16% Macro-F1, compared with 62.71% accuracy and 62.66% Macro-F1 for the SEMPO-only DualBase. Healthy, outer-race, and inner-race recalls reach 100.00%, 97.71%, and 96.77%, respectively. The protocol measures same-distribution window classification because windows from a physical bearing may occur in multiple partitions; it is not presented as unseen-bearing generalization.
Keywords
bearing fault diagnosis, SEMPO, Paderborn dataset, stratified sampling, multiscale convolution, supervised contrastive learning
Speaker
Bo Yang
Postgraduate Student Guangdong University of Technology

Submission Author
Bo Yang Guangdong University of Technology
Chong Chen Guangdong University of Technology
Xiaolin Tian Macau University of Science and Technology
Shaohui Zhang Dongguan University of Technology
Zhuyun Chen Guangdong University of Technology
Qiang Liu Guangdong University of Technology
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Important Date
  • Conference Date

    Nov 06

    2026

    to

    Nov 08

    2026

  • Oct 15 2026

    Draft paper submission deadline

Sponsored By
IEEE Instrumentation and Measurement Society
Organized By
Sichuan University