Introduction
AboutComponents, Circuits, Devices and Systems; Power, Energy and Industry Applications
Keywords:Silicon carbide MOSFETs ,Gallium nitride HEMTs,Gallium Oxide diodes and transistors,Packaging and integration,Gate-drivers,Power converters,Ultra-wide-band-gap,Characterization techniques,Device robustness,Device Reliability,Bi-directional switches,
Scope:Information exchange and discussions on state-of-the-art wide-band-gap power semiconductor devices, their packaging and application technologies. Focus areas of particular interests: monolithic integrated bi-directional switches; use of WBG devices in solid-state transformers, future power supplies for (AI) data-centres and electric transportation (including battery chargers); wireless and double-sided cooling packaging solutions; active gate-drivers.
Sponsor Type:1
Region10-Asia and Pacific
Call for paper

Important date

2027-01-11
Draft paper submission deadline
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Important Date
  • Conference Date

    Aug 22

    2027

    to

    Aug 25

    2027

  • Jan 11 2027

    Draft paper submission deadline

  • Aug 25 2027

    Registration deadline

Sponsored By
IEEE Power Electronics Society