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Introduction

The 12th International Conference on Mechanical and Electronic Engineering (ICMEE 2026) will be held in Guangzhou, China from December 29–31, 2026, hosted by South China University of Technology. Since its inception in 2009, ICMEE has been successfully held in Chennai (India), Kyoto (Japan), and multiple cities in China including Hefei, Tianjin, Beijing, Dalian, Xi’an, and Shenzhen.

ICMEE 2026 aims to provide a broad academic platform for scholars and experts worldwide in the fields of mechanical and electronic engineering, enabling deep understanding and exchange of innovative ideas, development trends, and frontier technologies. We look forward to stimulating in-depth discussions and collaborations among participants to further advance the field.

South China University of Technology is a national key university directly administered by the Ministry of Education of China, jointly built by the Ministry of Education and the Guangdong Provincial Government. It is listed in China’s “Double First-Class”, “Project 211”, and “Project 985” initiatives, and is selected into programs such as the “111 Plan”, the “Outstanding Engineer Education Training Program”, the “101 Plan”, and the first batch of university technology transfer and industrialization bases.

Committee

General Chairs: Yang Cong, South China University of Technology; Ying Luo, South China University of Technology

Co-General Chairs: Maode Yan, Chang’an University; Song Gao, Xi’an Technological University

Program Chairs: Xiaohong Wang, South China University of Technology; Jun suo Qu, Xi’an University of Posts and Telecommunications; Chaobo Chen, Xi’an Technological University; Fei Hui, Chang’an University

Program Committee Members: Junfeng Jing, Xi’an Polytechnic University; Pai Zheng, The Hong Kong Polytechnic University; Yi Xiong, Southern University of Science and Technology; Panpan Yang, Chang’an University; Wei Ai, South China University of Technology; Bin Li, South China University of Technology; Hongqiang Mo, South China University of Technology; Min Ye, Chang’an University; Xiaoru Song, Xi’an Technological University; Ting Zhang, Soochow University; Shaojie Tang, Xi’an University of Posts and Telecommunications; Lianfang Tian, South China University of Technology; Kun Yan, Xi’an Technological University; Lei Zuo, Chang’an University; Xiaohua Xia, Chang’an University; Bing Wang, Fuzhou University; Xiaohua Song, Xi’an Technological University; Binbin Zhang, Xi’an Technological University; Tianliang Li, Wuhan University of Technology; Tianli Ma, Xi’an Technological University; Zhiyu Jiang, Northwestern Polytechnical University; Yifan Li, Southwest Jiaotong University; Kai Cao, Xi’an Technological University

Student Program Committee Chair: Wei Ai, South China University of Technology; Bin Li, South China University of Technology

Publicity Chairs: Hongqiang Mo, South China University of Technology; Min Ye, Chang’an University; Xiaoru Song, Xi’an Technological University; Ting Zhang, Soochow University; Shaojie Tang, Xi’an University of Posts and Telecommunications

Regional Chairs: Lianfang Tian, South China University of Technology; Kun Yan, Xi’an Technological University; Lei Zuo, Chang’an University; Xiaohua Xia, Chang’an University; Bing Wang, Fuzhou University; Xiaohua Song, Xi’an Technological University; Binbin Zhang, Xi’an Technological University; Tianliang Li, Wuhan University of Technology; Tianli Ma, Xi’an Technological University; Zhiyu Jiang, Northwestern Polytechnical University; Yifan Li, Southwest Jiaotong University; Kai Cao, Xi’an Technological University

Track Chairs: Wei Ai, South China University of Technology; Bin Li, South China University of Technology; Hongqiang Mo, South China University of Technology

Call for paper

Papers accepted after peer review by the Program Committee will be published in the conference proceedings and indexed in IEEE Xplore, EI Compendex, Scopus, and other databases.

Submission Topics

1. Electronics and Communication Systems
Communication systems and integrated networks
Signal processing
Antennas and microwave technologies
Optoelectronics and photonics
Electromagnetic compatibility in mechanical systems
Circuits and power electronics for mechanical systems

2. Automation, Robotics, and Mechatronics
Robotics for industrial and mechanical applications
Mechatronic system design and control
Intelligent automation systems
Sensors and actuators for mechatronic systems

3. Biomedical and Wearable Mechatronic Systems
Biomedical electronics and biomechanical devices
Wearable electronics for motion and health monitoring
Biomimetic mechatronic systems

4. Materials and Manufacturing for Mechatronic Systems
Smart materials for electronics and mechanics
Lightweight structural composites
Advanced manufacturing technologies for integrated systems
Reliability and non-destructive testing

5. Computer and Energy Systems for Integrated Engineering
Computational mechanics and CFD for electronic thermal management
Energy management in mechatronic systems
Dynamics and vibration control
CAD/CAM technologies for mechatronic design

6. Interdisciplinary Mechatronic Applications
Marine and aerospace mechatronic systems
Noise and vibration mitigation in integrated systems
Electronic control of propulsion and combustion
Environmental sustainability and quality assurance

Guidlines

Official language of the conference: English. All submissions must be in English.

Templates:

1. https://www.icmee.org/Assets/files/conference-template-letter.docx

2. https://www.icmee.org/Assets/files/conference-latex-template_10-17-19.zip

For full-paper publication (in the double-column proceedings format), manuscripts should be 4–5 pages. For presentation-only participation, an abstract of 300–500 words suffices.

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Important Date

  • Conference Date

    Dec 29

    2026

    to

    Dec 31

    2026

  • Aug 01 2026

    Contribution Submission Deadline

  • Sep 20 2026

    Registration deadline

Sponsored By
South China University of Technology
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