Introduction
SPLC, the premier forum where practitioners, researchers and educators can present and discuss the most recent ideas, innovations, trends, experiences, and concerns in the area of software product lines and software product family engineering invites you to come to Tokyo Japan.
We invite a range of topics related to software product line engineering, both traditional and those that have not yet been addressed.
Call for paper
Submission Topics
These topics include but are not limited to:
Industrial experiences in product line engineering
Requirements management for product lines
Techniques and tools for product line engineering
Evolution and life-cycle issues of product line assets
Business is
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Important Date
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Conference Date
Aug 26
2013
toAug 30
2013
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Aug 30 2013
Registration deadline
Sponsored By
Global Software Engineering Laboratory, Waseda University
IPSJ The Special Interest Group on Software Engineering (IPSJ/SIGSE)
IPSJ The Special Interest Group on Software Engineering (IPSJ/SIGSE)
Contact Information
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