Introduction
We are pleased to invite you to attend the 2014 International Conference on Brazing, Soldering and Special Joining Technologies to be held in Beijing, China, from June 9 to 13, 2014. The conference will bring together international welding experts to share and discuss state-of-the-art researches involving brazing, soldering and special joining technologies. We look forward to welcoming you at Beijing.
Call for paper
Important date
2013-11-15
Abstract submission deadline
2014-01-15
Draft paper submission deadline
Submission Topics
The submitted papers are ativlsed but not limited to the following subjects:
Joining of ceramics and ceramic matrix composites (CMCs)
Joining of intermetal lies and superalloys
Micro- and nano- joining technologies
Lead-free solders and electr
All Comments
Important Date
-
Conference Date
Jun 09
2014
toJun 13
2014
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Nov 15 2013
Abstract Submission Deadline
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Jan 15 2014
Draft paper submission deadline
-
Jun 13 2014
Registration deadline
Sponsored By
中国焊接学会钎焊及特种连接专业委员会
Contact Information
- Mr. Lei Ye
- br******@163.com
- -**********
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