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Introduction
征文主题：Si、Ge、SOI、GOI、SiC和化合物半导体等衬底材料；用于集成电路和光电器件制造的高-k/金属栅叠层、Low-k材料、GeSi外延层、GeSn外延层、RRAM介质材料，STT-MRAM用磁性薄膜等新型薄膜材料；新型显示材料；碳纳米管，石墨烯等碳基功能材料；光刻胶、DSA、各类CVD和ALD前驱体、CMP抛光材料、工艺化学品、靶材等集成电路制造工艺材料；专用封装材料；材料检测技术与方法；材料设计理论与计算模拟
Call for paper

Important date

2014-04-30
Abstract submission deadline
2014-07-01
Draft paper submission deadline
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Important Date

  • Conference Date

    Jul 04

    2014

    to

    Jul 07

    2014

  • Apr 30 2014

    Abstract Submission Deadline

  • Jul 01 2014

    Draft paper submission deadline

  • Jul 07 2014

    Registration deadline

Sponsored By
中国材料研究学会
Organized By
集成电路材料产业技术创新战略联盟
Contact Information
  • 石瑛 北京多维电子材料技术开发与促进中心
  • in******@gmail.com
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