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Introduction
Casting and solidification processes are key technology for developing and improving various materials. This conference focuses on modeling of phenomena and/or processes involving solidification. The MCSP conference has served as Asian meeting in the field of casting / solidification modeling. It brings together leading academics, researchers and engineers from industry, and commercial software developers. We strongly encourage researchers, engineers and students to join the conference.
Call for paper

Important date

2014-08-15
Abstract submission deadline
2014-10-03
Draft paper submission deadline

Submission Topics

Topics - Modeling of casting processes (sand casting, HPD casting, thixocasting, rheocasting, lost foam, continuous casting ...) - Modeling of welding - Simulation and prediction of casting defects (porosity, micro/macrosegregation) - Modeling and simul
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Important Date
  • Conference Date

    Nov 24

    2014

    to

    Nov 26

    2014

  • Aug 15 2014

    Abstract Submission Deadline

  • Oct 03 2014

    Draft paper submission deadline

  • Nov 26 2014

    Registration deadline

Sponsored By
Osaka University