International Conference of Electronic Engineering and Information Science 2015 (ICEEIS2015)

International Conference of Electronic Engineering and Information Science 2015 (ICEEIS2015) will be held from Jan 17~18, 2015 in Haikou, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The conference will continue the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities.

ICEEIS2015 is sponsored by TTP Press, is supposed to be the largest technical event on electronic engineering and information science in Harbin in 2015. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICEEIS2015.

The topics of ICEEIS2015 cover semiconductor materials, nano materials, mechanical materials, MEMS materials，electronics engineering, information sceince and other topics.

All accepted papers will be published in the conference proceeding by TTP Press and be online available in full text via the publication platform, then be submited for indexing to Thomson ISI ( ISTP, CPCI, Web of Science), Scopus (by Elsevier) and EI/Compendex.