2014 IEEE International Conference on Communication Problem-Solving (ICCP 2014)

A : RF Circuit and subsystem Small Antenna, Planar/reflect antenna array, MCM, LCP/LTCC technologies, System on package, Subsystem integration, Passive device/circuits design and modeling, Active device/circuits design and modeling, RFIC & MMIC based on GaN/SiGe/RFCMOS, PLL technologies, High speed/high bits ADC/DAC, broadband/high power amplifier, etc. B : Digital Signal Process Technologies Channel modeling, Signal Processing technologies for link/access Communication Systems, Signal Processing for Radar and sensor Systems, Compressive Sensing, Sparse Signal Processing, Waveform Diversity and Design, Adaptive Anten-nas and Beamforming, MIMO or SAR imaging signal processing, 2D/3D image/video signal processing C : Networks Ad hoc, Body Area, Sensor and Mesh Networks, Wireless Multimedia Networks, Internet of Things, Network Measurement and Monitoring Techniques, Multimode Wireless Networks, Next-generation Networking Architectures, Network Design, Planning and Economics, Network Protocols, Applications & Services, Next-Generation Access Networking D : Application B3G/4G/5G Systems, WiMAX, LMDS, WLAN and WPAN, Multi-Hop and Cooperative Communications, Cognitive Radio and Software Defined Radio, Satellite & Space Communications, Multimedia Communications, Robustness and Resili-ence, Green Communications, Mobile and Pervasive Computing, UWB Communications, Internet of Thing, 60GHz/E-band/Q-band communication system, X-band/Ka-band/W-band radar system. E : Invited and Special Sessions The conference is soliciting proposals of invited and special sessions focusing on topics relevant to the conference. Prospective organizers should submit the proposals to the invited and special session chairs by email at secretary@ ic-cp.org before April 15, 2014.