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Introduction

DRIP was established at Montpelier by Prof. J. P. Fillard, the organizer of the first DRIP conference in 1985 and since that time a series of 15 conferences have been held in Europe, Asia and America. DRIP was originally an acronym for “Defect Recognition and Image Processing”. Although defect imaging is still the mainstream of this conference, image processing itself originated in the field of computer science and its contribution to this conference has lessened. It was felt that inclusion of the term “image processing” might distort the conference scope. Defect physics, in contrast, has recently become prevalent, for example, computer simulation of defect formation processes. We, therefore, refined DRIP to mean “Defects – Recognition, Imaging and Physics in Semiconductors“. For almost 30 years, DRIP has focused on all aspects of defects in semiconductors including point, line, planar and volume defects studied by a variety of techniques. This comprehensive approach has allowed for a discussion of the multifaceted effects of growth, processing and device fabrication and their interrelationships.

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Submission Topics

The overall technical scope and related topics: Physics of point and extended defects in semiconductors: origin, electrical, optical and magnetic properties of defects Defect mapping (of any type) over large area wafers graphenen Diagnostics techniques of crystal growth and processing of semiconductor materials (in-situ and process control) Device imaging to evaluate performance and reliability Defect analysis in degraded optoelectronic and electronic devices Imaging techniques (proximity probe, x-ray, electron beam, noncontact electrical, optical and thermal imaging techniques, etc.) New frontiers of atomic-scale-defect assessment using nanoprobe methods (STM, AFM, SNOM, ballistic electron energy microscopy, etc. )
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Important Date
  • Conference Date

    Sep 06

    2015

    to

    Sep 10

    2015

  • Sep 10 2015

    Registration deadline

Sponsored By
中国科学院苏州纳米技术
纳米仿生研究所
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