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Introduction

ICPNS'2016, the 8th International Conference on Physical & Numerical Simulation of Materials Processing, will be held on October 14-17, 2016 in Seattle, Washington, USA.

The conference is supported by the National Natural Science Foundation of China (NSFC) and is cosponsored by 20 societies and universities around the world, including those from Australia, Austria, Belgium, Brazil, Canada, China mainland, Croatia, Finland, France, Germany, Hong Kong, India, Japan, Korea, Pakistan, Russia, Sweden, Taiwan, UK and the USA.

This conference series, following the tradition of its seven predecessors in Harbin (1990), Hainan (1997), Beijing (1999), Shanghai (2014), Zhengzhou (2007), China (2010) and  Finland (2013) provides a forum for researchers around the world to present papers on recent advances in the overall field of physical and numerical methods and their applications in thermo-mechanical processing of advanced materials.

Call for paper

Important date

2016-01-14
Abstract submission deadline
2016-04-14
Draft paper submission deadline

Submission Topics

The conference will cover all aspects on Physical and Numerical Simulation of Materials Processing. It will focus on, but not restricted to, the following topics:

1.Physical Simulation and Numerical Modeling of Material Processing, Theories, Developments and Prospects.

2.The Industrial Processes of Welding and Bonding, Heat and Chemical Treatments, Casting, Forging and Plastic Deformation, Powder Metallurgy, High Energy Beam Processing and Other Advanced Processes.

3.Modelling and Simulation in Metallurgical Processing.

4.Software Engineering and Software Development for Material Processing, Computation and Design.

5.Iron and Steels, Nonferrous Alloys, Ceramics, Polymer, Composites.

6.High Temperature Alloys, Aeronautical and Space materials.

7.Ultrafine Grained Materials, Amorphous Materials, Metallic Glasses, High Entropy Alloys.

8.Nano Materials and Nano Technology, Micro-Mechanical Characterization of Materials.

9.Energy Materials, Electronic Encapsulating Materials, Biomaterials, Shape Memory Alloy, Smart Materials, Opto-electronic and Other Functional Materials.

10.Structural and Functional Thin Films, Surface Engineering and Coating.

11.Additive Manufacturing, 3D Print, Processes and Materials.

12.Phase Transformations and Microstructural Evolution.

13.Material Design Approaches and Experiences, Computation Materials Science and Molecular Dynamics Simulation, Artificial Neural Network and Expert System on Material Processing.

14.Material Behavior Characterization, at Nanoscale or in Extreme Condition.

15.Sustainability through Materials Processing and Waste Valorization.

16.Non Destructive Test of Materials.

17.Prediction and Evaluation on Structure and Performance of Materials.

18.Fatigue in Materials: Fundamentals, Multiscale Modeling and Prevention.

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Important Date
  • Conference Date

    Oct 14

    2016

    to

    Oct 17

    2016

  • Jan 14 2016

    Abstract Submission Deadline

  • Apr 14 2016

    Draft paper submission deadline

  • Oct 17 2016

    Registration deadline

Sponsored By
美国普渡大学
Organized By
美国普渡大学
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