1st IEEE International Conference on Internet-of-Things Design and Implementation (IoTDI 2016)

A confluence of many technological advances marks the advent of a new networked systems era. World data volume is growing at an unprecedented pace, much of it is from embedded devices. Smart cities are expected to grow, fed by millions of data points from multitudes of human and physical sources. Cyber-attacks grow more nefarious, bringing down physical systems. Social networks are becoming ubiquitous, offering information on physical things. The separation between cyber, physical, and social systems blurs. Collectively, these developments lead to the emergence of a new field, where networking and physical realms meet. It is the field of the Internet of Things (IoT). This conference offers an interdisciplinary venue to discuss challenges, technologies, and emerging directions in system design and implementation that pertain to the Internet of Things. Many sub-systems need to come together to address the needs of current and future applications. These subsystems extend from cloud back-ends to cyber-physical front ends. Reliability, security, robustness, correctness, and timeliness considerations in new medical, social, environmental, energy, and automation applications must be supported by advances in cloud resource management, network protocols, and smart embedded devices. This conference invites researchers and practitioners from academia, industry and government, and accepts original, previously unpublished work on Internet of Things topics.

General Co-Chairs

• Hui Lei, IBM, USA
• Wei Zhao, University of Macau, China

Program Co-Chairs

• Tarek Abdelzaher, University of Illinois at Urbana-Champaign, USA
• Jiannong Cao, Hong Kong Polytechnic University, China
• Pedro Marron, University of Duisburg-Essen, Germany

Steering Committee

• Tarek Abdelzaher (Co-chair), University of Illinois at Urbana-Champaign, USA
• Jean Bacon, University of Cambridge, UK
• Alejandro Buchmann, TU Darmsdat, Germany
• Jiannong Cao, Hong Kong Polytechnic University, China
• Insup Lee, University of Pennsylvania, USA
• Hui Lei (Co-chair), IBM, USA
• Pedro Marron, University of Duisburg-Essen, Germany
• Dilma Da Silva, Texas A&M University, USA
• Jack Stankovic, University of Virginia, USA
• Feng Zhao, Microsoft Research, China
• Wei Zhao, University of Macau, China