Description

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

Call for paper

Message

Leave a message

Refresh

Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com

Sponsored By

  • IEEE