Description

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

Call for paper

Message

Post a message

Refresh

Important dates

  • Conference Dates

    01 Jun.

    2021

    TO

    04 Jun.

    2021

Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com

Sponsored By

  • IEEE