2017 30th International Conference on VLSI Design and 2017 16th International Conference on Embedded Systems (VLSID)

1. DESIGN METHODOLOGIES AND TECHNOLOGY
M1: System-level Design: System-level design methodologies, processor and memory design, multicore systems, GPU design, on-chip communication architectures and networks-on-chip, performance analysis, defect-tolerant architectures, accelerators for emerging workloads (e.g., machine learning)
M2: Advances in Digital Design: Logic and physical synthesis, place and route, clock tree design, physical verification, timing and signal integrity, power integrity, design for manufacturability, design for yield, variation-tolerant design, design challenges for advanced technology nodes
M3: Analog, Mixed-Signal, and RF Design: Design of analog, mixed-signal, and RF IP, high-speed wired and wireless communication interfaces, low-power analog and RF, memory design, standard cell design
M4: Power-Aware Design: Power analysis and estimation, power optimization and low-power design, power-aware and energy-efficient design, thermal management, battery-aware design, energy harvesting
M5: CMOS Technology and Devices: Deep nanoscale CMOS devices, device modeling and simulation, multi-domain simulation, device/circuit-level reliability and variability models
M6: Emerging Technologies: MEMS, CMOS sensors, design methodologies for nanotechnology, post-CMOS devices, biomedical circuits, carbon nanotube-based computing, spintronics, silicon photonics, neuromorphic computing
2. DESIGN TOOLS AND EDA
T1: Design Verification: Functional verification, behavioral and RTL simulation, coverage-driven verification, assertion-based verification, gate-level simulation, emulation, hardware-assisted verification, formal verification, equivalence checking
T2: Test, Reliability, and Fault-Tolerance: DFT, fault modeling and simulation, ATPG, BIST, repair, delay test, fault tolerance, online test, AMS/RF test, board-level and system-level test, silicon debug, post-silicon validation, memory test, reliability testing, defect and fault recoverability
T3: Computer-Aided Design (CAD) tools: Logic and behavioral synthesis, logic mapping, simulation and formal verification, layout (partitioning, placement, routing, floor planning, and compaction)
3. EMBEDDED SYSTEMS DESIGN
E1: Embedded Systems Hardware: Hardware/Software co-design, embedded SoC, embedded multi-core systems, board-level hardware, hardware platforms for Internet-of-Things (IoT) devices
E2: Embedded Systems Software: Embedded operating systems, firmware, middleware, communication software, virtualization, embedded software for security and reliability, embedded applications
E3: FPGA Design and Reconfigurable Systems: Reconfigurable computing, FPGA architecture and FPGA circuit design, CAD for FPGA, FPGA prototyping, FPGA-based accelerators for cloud servers
E4: Wireless Systems: Wireless sensor networks, low-power wireless systems, wireless protocols, wireless power delivery
4. THEME TRACK: TECHNOLOGIES FOR A SECURE AND CONNECTED WORLD
S1: Healthcare Applications
S2: Smart Management of Energy Systems (e.g., Smart Grid)
S3: Intelligent and Secure Transportation Systems
S4: Safety Assurance of Embedded Circuits and Systems
S5: Secure Embedded Circuits and Systems