Description

The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Constanta, Romania on October 26th–29th, 2017.

Call for paper

Author guidelines

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:

  • suitability for one of the topics of the conference

  • scientific content and level, and the relevance of presented results;

  • correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:

  • the comments of the reviewers have been taken into consideration;

  • originality of the paper is given;

  • it corresponds with the paper template, English usage and grammar are correct,

  • signed IEEE copyright form has been submitted.

Topics of submission

  • Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare

  • Components, Assembling, and Manufacturing Technology

  • Design of Electronic Circuits and Systems

  • Electronics Simulation & Modelling

  • Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics

  • Applied Reliability

  • Challenges in Global Education

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Important dates

  • Conference Dates

    26 Oct.

    2017

    TO

    29 Oct.

    2017

  • 01 Jul.

    2017

    Abstract submission deadline

  • 01 Aug.

    2017

    Abstract notification of acceptance

  • 01 Sep.

    2017

    Final paper deadline

Contact information

  • Mihaela Hnatiuc
  • mhnatiuc@yahoo.com
  • siitme@siitme.ro

Sponsored By

  • University of Bucharest, Romania