he organising committee of SIITME 2014 kindly invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014.

Call for paper

Important date

Abstract submission deadline

Submission Topics

TOPICS A. Emerging Technologies & Trends in Advanced Packaging, Printed Electronics B. Power Electronics and Microsystems Packaging C. Assembly and Manufacturing Technology D. Design of Electronic Circuits and Systems E. Electronics Simulation & Modelling F. Electronics Applications and Automotive Electronics G. Optoelectronics & Advanced Communication Packaging H. Applied Reliability I. Challenge in Global Education
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