Introduction
he organising committee of SIITME 2014 kindly invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014.
Call for paper
Important date
2014-09-14
Abstract submission deadline
Submission Topics
TOPICS A. Emerging Technologies & Trends in Advanced
Packaging, Printed Electronics
B. Power Electronics and Microsystems Packaging C.
Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications and Automotive Electronics
G. Optoelectronics & Advanced Communication
Packaging
H. Applied Reliability
I. Challenge in Global Education
All Comments
Important Date
-
Conference Date
Oct 23
2014
toOct 26
2014
-
Sep 14 2014
Abstract Submission Deadline
Sponsored By
University of Bucharest
RO
RO
Contact Information
- si******@siitme.ro
- -**********
- 004*********
Previous Conferences
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2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) -
2018-10-25 Romania
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging -
2017-10-26 Romania
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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