The 48th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2018, the largest event in Europe dedicated to microwave components, systems and technology. The European Microwave Conference is a premier event to present the status and trends in the fields of microwave, millimetre-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design, and measurement. Examples include the latest developments for filters and passive components, modelling and design of RF MEMS and microsystems, high frequency and high data rate microwave photonics, highly stable and ultra low-noise microwave and millimetre-wave sources, new linearization techniques, 5G, IoT, and the impact of new packaging technologies on development applications. Special emphasis will be placed on emerging technologies, additive manufacturing techniques and materials for microwave components such as nanotechnologies and graphene, metamaterial structures and devices, tuneable RF components, reconfigurable RF systems and system-in-package. The scope also includes electromagnetic field theory, theoretical and experimental developments in wave propagation and antenna systems, and advanced simulation and characterization techniques. An additional focus will be put on the system implications of future microwave communications, wireless power transfer, radar with wireless communication capability, millimetre-wave imaging systems, and microwaves in industrial and medical applications.

The European Microwave Conference provides many opportunities for networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. With carefully selected papers in more than 40 oral and poster sessions, the conference represents an exciting forum for the presentation and discussion of the most recent advances in the microwave arena. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defence systems, etc.

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Important date

Abstract submission deadline
Draft paper submission deadline
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Final paper submission deadline


Passive Components, Circuits and Subsystems
E1 Planar Passive Components and Circuits: Planar
transmission lines, couplers, dividers/combiners,
hybrids, lumped-element circuits, tunable planar
components and devices, additive manufacturing
E2 Non-Planar Passive Components and Circuits:
Non-planar micromachined transmission lines,
waveguides, couplers, dividers/combiners,
hybrids, tunable components and devices, additive
manufacturing techniques
E3 Planar Filters and Multiplexers: Innovative synthesis
and analysis, active fi lters, additive manufacturing
E4 Non-Planar Filters and Multiplexers: Innovative 3D
fi lters and multiplexers solutions, and non-planar
innovative integrated technologies (LTCC, Liquid
Crystal Polymer, MCM-Deposition), additive
manufacturing techniques
E5 Ferroelectrics, RF MEMS, MOEMS and NEMS: Bulk
and thin-fi lm ferrite components, surface and bulk
acoustic wave devices including FBAR devices,
RF micro-electro-mechanical and micromachined
components and subsystems
E6 Metamaterials, Frequency Selected Surfaces and
Electromagnetic Bandgap Structures
E7 Interconnects, Packaging and Multi-Chip
Modules: Assembly methods, hybrid integration,
interconnects and multi-chip modules,
heterogeneous IC technologies
E8 Emerging Materials and Technologies: Emerging
2D/3D printing techniques, graphene, novelmaterial
based nanotechnology, nanodevices,
nanoscale RF components, superconducting RF
materials and devices, additive manufacturing
techniques, organic plastics and other
Active Components, Circuits and Subsystems
E9 Low Noise Circuits and Modules (*): LNA,
detectors, receivers, radiometers
E10 Frequency Generation, Conversion and Control:
Oscillators, VCOs, phase-locked loops and
frequency synthesizers, mixers, frequency
E11 Front-End and Transceiver Modules, Systemin-Package
Technologies: Analog and digital
front-end architectures, modulators/demodulators,
analogue RF and mixed signal SIP, switches, phase
shifters, limiters
E12 Tunable and Reconfi gurable Circuits and Systems
(*): Reconfi gurable transceiver circuits, modules
and amplifi ers
E13 Hybrid High Power Amplifi ers: High-power
amplifi er design, power combining techniques,
vacuum electronics
E14 Power Amplifi ers, Effi ciency Enhancement and
Linearization (*): Characterization and power
amplifi er behavioral modelling, linearization and
predistortion techniques
E15 Sub-THz and THz Circuits and Modules
E16 Microwave Photonic Circuits and Systems (*):
Including indium phosphide and silicon nitride
based photonic integrated circuits
Field and Circuit Analysis, Simulation and
Characterization Techniques
E17 Electromagnetic Field Theory and Numerical
Techniques: Frequency and time domain
modelling, periodic structures, sparse arrays,
simulation of electrically large problems, multiscale
and multi-physics approaches
E18 Electromagnetic Compatibility and Interference,
Signal Integrity
E19 Interaction of Electromagnetic Waves with Matter,
Biological Effects, Electromagnetic Scattering:
Electromagnetic propagation and absorption
phenomena, electrodynamic characterization
of biological materials, interaction at atomic/
molecular/macroscopic level
E20 Measurement Techniques and Systems from RF to
THz: Frequency and time domain measurements,
automated performance testing
Antennas and Propagation
E21 Antenna Design and Characterization (**):
Modelling, calibration and measurements, antenna
E22 Integrated Antennas: Active antennas,
reconfi gurable antennas
E23 Phased Arrays (Active/Passive), Related Circuits
and Components, Tx/Rx Module Technologies (**)
E24 Smart Antennas, Digital Beam-Forming and MIMO
E25 Channel modelling and Measurements: Extended
channel models, cluster emulation, narrowband
and wideband channel measurements
Systems and Applications
E26 Microwave Systems: System simulation and
characterization, base-station front-ends
and handheld transceivers, satellite systems,
navigation and positioning systems, industrial
systems, vehicular applications and intelligent
transportation systems
E27 Millimeter-wave, THz Technologies and Systems
(**): mm-Wave and THz wireless communications,
imaging/spectroscopy, sensors
E28 Ultra Wide Band Technology and Systems
E29 Emerging System Architectures: Mixed signal
processing, advanced modulation techniques,
optimized and highly integrated RF front-ends and
E30 Wireless Power Transfer and Energy Harvesting
E31 Biomedical Applications
E32 Wireless High Data Rate Communications and
Cognitive Radio: 3G/4G/5G systems, softwaredefi
ned radio, wireless transceiver systems
E33 RFID, Near Field Communication, Microwave/
Wireless Sensors and Sensor Networks: Including
non-destructive testing and crowd sensing
E34 Process Automation, Mobility, and Logistics:
Industry 4.0, intelligent transport systems
and smart logistics, machine-to-machine
communications, smart metering, smart cars and
General topic
E35 Education and RF Engineering: Online teaching,
e-learning, moocs, engineering education,
international exchange programs
(*) common topic with EuMIC
(**) common topic with EuRAD 

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Important Date
  • Conference Date

    Sep 25



    Sep 27


  • Feb 12 2018

    Abstract Submission Deadline

  • Feb 12 2018

    Draft paper submission deadline

  • Apr 12 2018

    Draft Paper Acceptance Notification

  • Jun 11 2018

    Final Paper Deadline

  • Sep 27 2018

    Registration deadline

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