The 47th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2017, the largest event in Europe dedicated to microwave components, systems and technology. The European Microwave Conference is a premier event to present the status and trends in the fields of radio frequency, microwave, millimetre-wave, and terahertz devices, systems, and technologies. A broad range of high-frequency related topics, from materials and technologies to integrated circuits and systems will be addressed in all their aspects: theory, simulation, design, measurement, and real-world applications. Examples include the latest developments of filters and passive components, modelling and design of RF MEMS, high-frequency and high data-rate microwave photonics, highly stable and ultra low-noise signal sources, new linearisation techniques, and the impact of new packaging technologies on device and system performance. Special emphasis will be placed on emerging materials and technologies for microwave components such as metamaterials, nanotechnologies, tunable and reconfigurable RF components and systems, and system-in- package solutions. The scope also includes electromagnetic field theory, theoretical and experimental developments in electromagnetic wave propagation and antenna systems, and advanced simulation, characterisation, and emulation techniques. Beside these elementary aspects, the second focus will be put on the impact of RF, microwave, millimetre-wave, and terahertz technologies on applications shaping our society’s future. Major examples include mobile terrestrial and satellite-based communications, advanced radar sensing and imaging, navigation and localisation, process automation, automotive and intelligent traffic systems, energy harvesting and wireless power transfer, high-power applications, biomedical sensing, and electromagnetic compatibility issues. The European Microwave Conference provides many opportunities for networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. With carefully selected papers in more than 40 oral and poster sessions, the conference represents an exciting forum for the presentation and discussion of the most recent advances in the microwave area. In addition to scientific papers, contributions on industrial applications are strongly encouraged, covering the above listed fields of applications.

Call for paper

Topics of submission


  • Planar Passive Components and Circuits: Transmission line elements and devices, distributed-line and lumped-element approaches, circuit synthesis and analysis, equivalent circuits

  • Planar and Non-Planar Filters and Multiplexers: Planar, waveguide, coaxial, dielectric filters, resonators, couplers, dividers/combiners, frequency and time domain approaches, performance evaluation

  • Tunable and Reconfigurable Circuits and Systems: Electronic, magnetic, mechanic, thermal tuning approaches, switches and switching devices, tunable, reconfigurable or programmable devices, performance metrics and evaluation

  • Multiferroics, Electro-Optics, RF MEMS and NEMS, and MOEMS: Electronically and magnetically controllable RF properties, multi-physical transduction mechanisms and devices, micromachined components, ferrite, bulk and surface acoustic devices, multi-layer

  • Metamaterials, Frequency-Selective Surfaces, and Electromagnetic Bandgap Structures: components, radiative and non-radiative leaky-wave structures, simulation of periodic structures, dispersion and bandgap engineering

  • Interconnects, Packaging and Multi-Chip Modules: First- and second-level interconnects, hybrid integration, substrate technologies, thin- and thick-layer multi-layer technologies, low-parasitic assembly and packaging approaches, electronic, mechanic and

  • Emerging Material, Circuit, and Device Technologies: Inorganic and organic, solid-state, soft or liquid, crystalline or amorphous electronic materials and devices, superconducting RF materials and devices, fabrication and characterisation techniques


  • Active Tunable and Metamaterial Circuits and Non-Foster-Circuits: Artificial transmission line elements and circuits, electronic reactance elements, active matching circuits, stability and noise considerations, active, tunable and integrated filters

  • Low-Noise Circuits and Modules: Low-noise detectors, amplifiers and frontends, radiometers, semiconductor technology and circuit-design issues, noise modelling

  • Linear and Nonlinear Frequency Conversion Techniques: Modulators, mixers, frequency multipliers/dividers, short- and long-term stability, harmonic distortion, intermodulation and spectral purity

  • High-Frequency Generation Techniques: Two- and three-pole oscillator circuits, analog, digital and mixed-signal oscillator architectures, small- and large-signal design approaches, reference oscillators, phase-locked loops, frequency synthesizers, frequency conversion and control systems

  • Power Amplifiers and Smart Transmitters: Efficiency Enhancement, Linearisation, and Hybrid Integration: Cartesian and polar power amplifier design, behavioral modelling, continuous and switch-mode operation, linearisation and predistortion techniques, efficiency enhancement, adaptive gain

  • Vacuum Electronics: Standing and traveling-wave tube amplifiers and generators, efficiency enhancement, modelling and simulation, packaging and integration

  • Front-End and Transceiver Modules: Analog and digital front-end designs, heterodyne low- and zero-IF and homodyne architectures, mixed-signal approaches, multi-standard and multi-band capabilites, system noise temperature, effi ciency, dynamic range and bandwidth considerations


  • Electromagnetic Field Theory and Numerical Techniques: Resonant and broadband waveguiding structures, frequency and time domain modelling, finite difference, finite element, integral equation and hybrid methods, periodic structures, sparse arrays, boundary conditions and mode matching, multi-scale and multi-physics approaches

  • Electromagnetic Compatibility, Signal Integrity and Electromagnetic Interference: Field emission and immission modelling and measurements, electromagnetic compatibility, robustness and interference issues, signalflow device modelling, distortion and stability analyses, digital pre- and postdistortion techniques

  • Interaction of Electromagnetic Waves with Matter, Electromagnetic Scattering: Electromagnetic propagation and absorption phenomena and numerical modelling, effective medium approaches, electrodynamic characterisation of biological materials and living systems, interaction on atomic/molecular/macroscopic level, radar cross-section

  • Measurement Techniques and Systems from RF to Terahertz: Frequency and time domain measurements, narrowband and wideband characterisation, de-embedding and calibration, automated performance testing

  • Simulation of Electrically Large Problems: Characteristic mode analysis, numerically effi cient simulation approaches, model order reduction, methods of approximation


  • Integrated Antennas: Design, implementation and measurements of integrated active and passive antennas and feed circuitry, hybrid and monolithic integration, substrate and packaging technologies, size and efficiency considerations

  • **) Phased Arrays (Active/Passive), Related Circuits and Components, Tx/Rx Module Technologies: Array design, feed and distribution network, phase shifters and delay lines, receive and transmit arrays, active and passive retrodirective arrays, bias and control circuitry,

  • Antenna Systems: Theory, Modelling, Calibration and Measurements: Modelling and design of electrically small antennas, characteristic mode analysis, sparse arrays, nearfield measurements, time-domain measurements, nearfield-farfield transformations

  • Smart Antennas, Antenna Systems with Digital Beam Forming, MIMO Antennas: Smart antennas, multi-beam antennas, beam forming and beam steering, analog and digital vector-modulators, multi-antenna systems, diversity schemes, MIMO antennas, massive-MIMO approaches

  • Channel Measurements and Modelling: Narrowband and wideband channel measurements at RF, microwave, millimetre-wave and THz frequencies, channel modelling for mobile and car-to-x communications, extended channel models, cluster representation

  • Channel Emulation and Over-the-Air Testing: Wave-field synthesis, cluster emulation, virtual radio environment, conducted and wireless over-the-air testing, wireless-cable approaches, MIMO-OTA testing, radio channel emulators


  • System-in-Package Technologies from RF to Terahertz and Photonics: Dielectric and substrate materials, LTCC, LCP and MCM technologies, component and subsystem packaging, assembly methods, 3D-printing, wafer stacking, 3D-interconnects

  • System Technologies from RF to Terahertz: High-speed, wideband and ultra-wideband systems, mixed-signal architectures and systems, analog-digital conversion, programmable and software-defined systems, commercial as well as industrial-scientific-medical applications,

  • Ultra-Wideband Technology and Systems: Ultra-wideband sensing, localisation and communication techniques and applications, imaging and spectroscopy, system implementation, performance evaluation

  • Emerging Architectures for Wired and Wireless Systems from RF to Terahertz: Flexible and wearable devices, system architectures and topologies, embedded systems, distributed systems, electronic dust

  • Mobile and Satellite Communications: Antennas, sensors and front-ends for base transceiver stations and user terminals for mobile and car-to-x communications, sensing and wireless data transmission, MIMO antennas, ground- and space-based antennas and microwave equipment

  • Navigation and Localisation: Satellite-based navigation systems, multiconstellation and multi-band receivers, robust navigation systems for safety-, security-, environmental- or liability-critical applications, in-door navigation, intelligent navigation

  • Process Automation, Mobility, and Logistics: Microwave devices, systems and applications in process automation (Industry 4.0), intelligent transport systems and smart logistics, machine-to-machine communications, smart metering, smart cars, smart grids

  • Wireless Power Transfer and Energy Harvesting: Short and long-range device and system designs, nearfield and farfield techniques, high-power applications, rectifier circuits, energy harvesting techniques, circuits and devices

  • High-Power Microwave and Millimetre-Wave Applications: Microwave and millimetre-wave-assisted heating, sintering, and physical/chemical material synthesis and processing, nuclear fusion, non-destructive evaluation and testing

  • Biological and Medical Applications, Wireless Health Care and Ambient Assisted Living: Diagnostic and therapeutic applications, biological and clinical measurement and treatment systems, wireless medical sensors and implants, body-area networks, medical telemetry and te

  • RFID, Near Field Communication, Sensor Networks and Sensor Data Fusion: Passive and active RFID tags and readers, low-power nearfield communication, multi-physical sensor design, non-destructive testing, remote sensing, sensor networks, sensor fusion and data fusion

  • Cognitive Radio and Wireless Multimedia Communications: Adaptive antenna and front-end concepts, circuits for cognitive radio applications, broadband high-speed power and spectrum sensing, software-defined radio


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Important dates

  • Conference Dates

    10 Oct.



    12 Oct.


  • 13 Feb.


    Abstract submission deadline

  • 13 Feb.


    Draft paper submission deadline

  • 07 Apr.


    Draft paper acceptance notification

  • 05 Jun.


    Final paper deadline

Contact information

  • Christian Bornkessel
  • Matthias Hein

Sponsored By

  • European Microwave Association - EuMA

Conference Series