IMWS-AMP 2018 conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2018 isorganized by the IEEE Microwave Theory and Techniques Society (MTT-S) with the technical co-sponsorship of the European Microwave Association (EuMA). The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.


Conference General Chair: 
Amir Mortazawi 
University of Michigan, Ann Arbor, USA

Conference General Co-Chair: 
Raafat Mansour 
University of Waterloo, ON, Canada

Technical Program Chair: 
Robert Weigel 
Institute of Electronics Engineering, Germany

Technical Program Co-Chairs:
Christopher Nordquist 
Sandia National Laboratories, NM, USA 

Amelie Hagelauer 
Institute of Electronics Engineering, Germany 

Jianguo Ma 
Guangdong University, China

Conference Finance Chair:
Pai-Yen Chen 
Wayne State University, USA

Call for paper

Important date

Draft paper submission deadline
Draft paper acceptance notification
Final paper submission deadline

Conference Topics

Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and systems, including but not limited to:  

  • RF, microwave and THz components and circuits based on new materials 1

  • Advanced manufacturing processes

  • Additive manufacturing & 3D-printing

  • Wearable components and antennas

  • Organic RF electronics and devices

  • Components based on inkjet printing

  • Smart and functional materials

  • Sensor technologies

  • Artificial and engineered materials

  • Microwave devices based on semiconductor materials

  • Nanomaterials (e.g., graphene, CNT)

  • High-speed memory materials

  • Bio-materials

  • Multiphysics modeling

  • Material characterization

  • Integration and interconnect technologies


Authors of prospective papers for IMWS-AMP 2018 are required to upload a 3-pages paper in PDF format via the  IMWS-AMP Paper Submission Website.

Papers must be written in English and formatted in the standard conference proceedings layout. Word or Latex Templates can be downloaded from the IEEE Conference Publishing site. Please, be sure to use the template's conference mode (LaTeX users).

Please check carefully the author information when uploading your prospective paper, since this information is used directly to create the Conference Program booklet. Submissions in hardcopy form or by fax or e-mail cannot be accepted.

After review, the authors of accepted papers will have the opportunity of changing details and introduce modifications suggested by the reviewers. Before uploading the final paper, at least one author must register for the conference.

Notification of acceptance will be communicated to the authors via e-mail by May 18, 2018. Accepted papers will be published in the IMWS-AMP 2018 conference proceedings as well as in the IEEE Xplore. The final camera ready paper submission is due June 01, 2018.

Authors of accepted papers should upload their final paper in PDF format via the IMWS-AMP 2018 paper submission website.  The PDF file must be compliance with IEEE eXpress PDF format: for this purpose, authors can check the compliance or create the PDF file on the IEEE PDF eXpress site with the code [44569X] as Conference ID. The length of the final paper is 3 pages. Papers shorter than 3 pages will not be published in IEEE Xplore. 

Authors are responsible for obtaining publication approval by their employer or sponsor and the copyright must be assigned to the IEEE. The direct link to submit the IEEE electronic Copyright Form can be found at the end of the final paper submission process.

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