Presentation List
My Presentations
Influence of CucorAl wire bonding on reliability of SiC devices
Fang Chao engineer Zhuzhou CRRC Times Semiconductor Co., Ltd.
PUBLIC Poster Presentation
Development and applications of packaging materials for power semiconductor devices
Mingxiang Chen Huazhong University of Science and Technology (HUST)
K /K1 2021-08-26 11:10 ~ 11:50
ATTENDEE Invited speech
Evaluating Switching Performance of GaN HEMT Using Analytical Modeling
Yingzhe Wu University of Electronic Science and Technology of China
PUBLIC Poster Presentation
Evaluation of Dynamic On-Resistance of InnoGaN and its Application for High-Density Power Converters
Shan Yin Application Director Innoscience (Zhuhai) Technology Co.,Ltd
IS /IS 2021-08-27 10:00 ~ 10:25
ATTENDEE Oral Presentation
Power devices and power supply test solution
Yucai Liu Marketing Manager in Guangzhou ZHIYUAN Electronics Co., Ltd
IS /IS 2021-08-27 10:25 ~ 10:50
ATTENDEE Oral Presentation
Test Beyond JEDEC – SiC MOSFET Reliability Supplemental Tests
Ye Zhong CTO InventChip Technology Co., Ltd.
ATTENDEE Oral Presentation
The Latest Testing Methods and Solutions in Wide BandGap
Wanner Huang Tektronix Senior Bus Tektronix(China)Co.,Ltd.
IS /IS 2021-08-27 10:50 ~ 11:15
ATTENDEE Oral Presentation
Graphical development platform for industrial controller
Shen Su Assistant General Ma RTUNIT(Nanjing Rtunit Information Technology Co., Ltd.)
ATTENDEE Oral Presentation
Important Date
  • Conference Date

    Aug 25



    Aug 27


  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

Sponsored By
Organized By
Huazhong University of Science and Technology