Presentation List
My Presentations
New powder core material and its new applications
Yunfan Zhang R&D manager POCO Holding co., ltd.
IS /IS
2021-08-27 09:20 ~ 09:45
ATTENDEE Oral Presentation
TMR-Based current sensor with core-less design for high-frequency current detection
Xiaopeng Xu Sinomags Technology Co., LTD
IS /IS
2021-08-27 08:55 ~ 09:20
ATTENDEE Oral Presentation
SiC Power Modules for Rail Traction & SST applications
Siqing Lu Deputy Section Chief Mitsubishi Electric
IS /IS
2021-08-27 08:30 ~ 08:55
ATTENDEE Oral Presentation
The Research of High Frequency, High Efficiency and High Power Density (3H) Application for GaN Devices
Yong Kang Huazhong University of Science and Technology；School of Electrical and Electronic Engineering
K /K1
2021-08-26 10:30 ~ 11:10
ATTENDEE Invited speech
Technology Trends of SiC Chips and Modules
Kondo Harufusa Mitsubishi Electric
K /K2
2021-08-26 14:30 ~ 15:10
ATTENDEE Invited speech
Development of High Voltage SiC Power MOSFETs
Song Bai State Key Laboratory of Wide Bandgap Semiconductor Power Electronic Devices
K /K2
2021-08-26 15:10 ~ 15:50
ATTENDEE Invited speech
WBG Power Devices and Digital Design Framework: Challenges, Possibilities, Opportunities
Stig Munk-Nielsen Aalborg University
K /K2
2021-08-26 16:00 ~ 16:40
ATTENDEE Invited speech
Designing Wide Bandgap Power Electronic Systems
Alan Mantooth UNIVERSITY OF ARKANSAS
K /K1
2021-08-26 09:40 ~ 10:20
ATTENDEE Invited speech
Next Generation of Power Supplies: EV On-Board Charger
Fred C. Lee Virginia Tech
K /K1
2021-08-26 09:00 ~ 09:40
ATTENDEE Invited speech
A Multi Time-Scale Electro-thermal Co-Simulation Approach of SiC-MOSFET Considering Distribution of Electro-thermal Stress on Chip
Xin Li Naval University of Engineering
Room1
ATTENDEE Oral Presentation
Important Date
-
Conference Date
Aug 25
2021
toAug 27
2021
-
Apr 21 2021
Abstract Submission Deadline
-
May 15 2021
Abstract Notification of Acceptance
-
Jun 25 2021
Final Paper Deadline
-
Aug 24 2021
Contribution Submission Deadline
Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology
Contact Information
Previous Conferences
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2023-08-27 Taiwan, China Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) -
2018-05-17 China xian
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia(WiPDA Asia 2018)
