Presentation List
My Presentations
New powder core material and its new applications
Yunfan Zhang R&D manager POCO Holding co., ltd.
IS /IS 2021-08-27 09:20 ~ 09:45
ATTENDEE Oral Presentation
TMR-Based current sensor with core-less design for high-frequency current detection
Xiaopeng Xu Sinomags Technology Co., LTD
IS /IS 2021-08-27 08:55 ~ 09:20
ATTENDEE Oral Presentation
SiC Power Modules for Rail Traction & SST applications
Siqing Lu Deputy Section Chief Mitsubishi Electric
IS /IS 2021-08-27 08:30 ~ 08:55
ATTENDEE Oral Presentation
The Research of High Frequency, High Efficiency and High Power Density (3H) Application for GaN Devices
Yong Kang Huazhong University of Science and Technology;School of Electrical and Electronic Engineering
K /K1 2021-08-26 10:30 ~ 11:10
ATTENDEE Invited speech
Technology Trends of SiC Chips and Modules
Kondo Harufusa Mitsubishi Electric
K /K2 2021-08-26 14:30 ~ 15:10
ATTENDEE Invited speech
Development of High Voltage SiC Power MOSFETs
Song Bai State Key Laboratory of Wide Bandgap Semiconductor Power Electronic Devices
K /K2 2021-08-26 15:10 ~ 15:50
ATTENDEE Invited speech
WBG Power Devices and Digital Design Framework:   Challenges, Possibilities, Opportunities
Stig Munk-Nielsen Aalborg University
K /K2 2021-08-26 16:00 ~ 16:40
ATTENDEE Invited speech
Designing Wide Bandgap Power Electronic Systems
K /K1 2021-08-26 09:40 ~ 10:20
ATTENDEE Invited speech
Next Generation of Power Supplies: EV On-Board Charger
Fred C. Lee Virginia Tech
K /K1 2021-08-26 09:00 ~ 09:40
ATTENDEE Invited speech
Important Date
  • Conference Date

    Aug 25



    Aug 27


  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

Sponsored By
Organized By
Huazhong University of Science and Technology