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Introduction

It is our pleasure to extend a warm welcome to all delegates to participate in 2021 IEEE 4th International Conference on Electronics Technology (ICET) which is yearly held in Chengdu, China.It is organized by the Sichuan Institute of Electronics, sponsored by IEEE, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University and Singapore Institute of Electronics.  IEEE ICET 2021 will be from May 7th to 10th (Friday to Monday).

The primary aim of ICET conference is to offer senior and young scientists from academic communities and electronic industries from all over the world the opportunity to exchange research ideas and share new knowledge, development and experiences on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and electronic packaging in a convenient and multicultural atmosphere. The other key aim of ICET is to provide postgraduate students with the opportunity to present their research findings in front of experts from both academia and industry for scholarly feedback. It also provides university academics and industry the opportunity to interact with the technical community, to share experiences and gain the benefit from the latest developments in technology presented at the conference. We sincerely hope that all delegates can have rich, useful, and effective deliberations that can lead to international cooperation. 

You are invited to participate in this great event for sharing ideas, friendship and culture in the long history and hospitality city-Chengdu.

Sponsor Type:5; 5

Committee

Advisory Chairs

Prof. Andrea Massa, University of Trento, Italy |  IEEE Fellow

Prof. Eiji Oki, Kyoto University, Japan | IEEE Fellow, IEICE Fellow

Conference Chairs

Prof. Yuan Lin, University of Electronic Science and Technology of China

Prof. Shiwen Yang, University of Electronic Science and Technology of China | IEEE Fellow

Prof. Vladimir Terzija, Shandong University, China | IEEE Fellow

Program Chairs

Prof. Xiangxian Chen, Zhejiang University, China

Prof. Chan Siew Hwa, Nanyang Technological University, Singapore

Prof. Tianrui Li, Southwest Jiaotong University, China

Prof. Danny Sutanto, University of Wollongong, Australia

Dr. Fang Deng, Whirlpool Corporation, USA

Technical Program Committee

Prof. Gang Feng, University of Electronic Science and Technology of China

Prof. Huang Qi, University of Electronic Science and Technology of China, China

Prof. Weihao Hu, University of Electronic Science and Technology of China, China

Prof. Jieh-Shian Young, National Changhua University of Education, Taiwan

Prof. Gene Eu Jan, National Taipei University, Taiwan

Prof. Heng Chen, Chinese Academy of Sciences, China

Prof. Changjie Tang, Sichuan University, China

Prof. Shu Peng Liu, Shanghai University, China

Prof. Qiuxi Jiang, National University of Defense Technology, China

Prof. Guoliang Ye, Dongguan University of Technology, China

Prof. Xiuping Shi, C-EPRI Electric Power Engineering Co, China

Prof. Renfu Li, Huazhong University of Science and Technology, China

Prof. Du Bin, Sichuan University, China

Prof. Yu-En Wu, National Kaohsiung University of Science and Technology, Taiwan

Prof. Hengxu Zhang, Shandong University, China

Prof. Maode Ma, Nanyang Technological University, Singapore

Prof. Letian Huang, University of Electronic Science and Technology of China

Prof. Emanuel Grant, University of North Dakota, USA

Prof. A. R.Al-Ali, American University of Sharjah, UAE

Prof. Axel Sikora, Offenburg University of Applied Sciences, Germany

Prof. Jianhong Zhou, University of Electronic Science and Technology of China

Prof. Yen-Da Chen, Lunghwa University of Science and Technology, Taiwan

Prof. Chao-Tsun Chang, Hsiuping University of Science and Technology, Taiwan

Prof. Hao Shiqi, State key Laboratory of Pulsed Power Laser Technology National Defense University, China

Prof. Zhang Weiping, North China University of Technology, China

Prof. Bao Lei, Wuhan Donghu University, China

Prof. Dongtang Ma, National University of Defense Technology, China

Prof. Wang Peijun, Southwest Jiaotong University, China

Prof. Assim Hameed Yousif Al Daraje, Philadelphia University, Jordan

Prof. Chua-Chin Wang, National Sun Yat-Sen University Kaohsiung, Taiwan

Prof. Yuming Fang, Nanjing University of Posts and Telecommunications, China

Prof. Arezki BENFDILA, Mouloud Mammeri University, Algeria

Prof. Chenn-Jung Huang, National Dong Hwa University, Taiwan

Prof. Jun Yang, National University of Defense Technology, China

Prof. Qiang Tong, Shenzhen Insitute of Information Technology, China

Prof. Zhangfa Liu, Beijing Jiaotong University Beijing, China

Prof. Wang Yuan, Peking University, China

Prof. Yuanfu Zhao, Beijing Microelectronics Technology Institute Beijing, China

Prof. Guangrong Li, Nanjing Institute of Technology, China

Prof. Chen Pingping, Fuzhou University, China

Prof. Jianhong Zhang, North China University of Technology, China

Prof. Xiongzhu Bu, Nanjing University of Science and Technology, China

Prof. Min Bao, Xidian University, China

Assoc. Prof. Zhiwei Li, National University of Defence Technology, China

Assoc. Prof. Yanjun Fu, Xi’an International University, China

Assoc. Prof. Jiangtao Huangfu, Zhejiang University, China

Assoc. Prof. Shiwen Lei, University of Electronic Science and Technology of China, China

Assoc. Prof. Yu Lu, Shenzhen Technology University, China

Assoc. Prof. Jianbin Gao, University of Electronic Science and Technology of China

Assoc. Prof. Zhaojun Zhu, University of Electronic Science and Technology of China

Assoc. Prof. Jin Xu, Sichuan University Jinjiang College, China

Assoc. Prof. Dake Tian, Shenyang Jianzhu University, China

Assoc. Prof. Wei Chen, Dongguan University of Technology, China

Assoc. Prof. Haigang Feng, Information Science & Technology Tsinghua Shenzhen International Graduate School, China

Assoc. Prof. Mingwu Yao, Xidian University, China

Assoc. Prof. Zhou Hang, Peking University Shenzhen Graduate School, China

Assoc. Prof. Hailong Jiao, Peking University Shenzhen Graduate School, China

Assoc. Prof. Lamin Zhan, Huazhong University of Science and Technology, China

Assoc. Prof. Haiqin Xu, Donghua University, China

Assoc. Prof. Xiuli Wang, Shanxi University, China

Assoc. Prof. Yang Liu, Northwestern Polytechnical University, China

Assoc. Prof. Guofeng Jiang, Air Force Engineering University, China

Assoc. Prof. Wang Yang, Xiangtan University, China

Assoc. Prof. Jing Li, the Second Research Institute of Civil Aviation Administration of China (CAAC), China

Assoc. Prof. Tiedong Cheng, Jiangxi University of Science and Technology, China

Assoc. Prof. Li Yan, CEPRI, China

Assoc. Prof. Jianjun Yang, University of North Georgia, USA

Assoc. Prof. Li Xiang, Guilin University of Electronic Technology Guilin, China

Assoc. Prof. Cui Wei, Information Center of Ministry of Science and Technology, China

Assoc. Prof. Feng Yan, Northwest Institute of Nuclear Technology, China

Assoc. Prof. Mu Li, Hunan University of Science and Technology, China

Assoc. Prof. Sheng-Kuan Wang, Ming Chi University of Technology, Taiwan

Assoc. Prof. B. Rama Devi, Kakatiya institute of Technology and Science, India

Assoc. Prof. Gang Xu, Institute of Electronic Engineering, China Academy of Engineering Physics, China

Assoc. Prof. Rustam Asnawi, Yogyakarta State University D.I. Yogyakarta, Indonesia

Assoc. Prof. Wei Fu, Chongqing University of Posts and Telecommunications, China

Assoc. Prof. Xiuli Wang, Shanxi University, China

Assoc. Prof. Janelli M. Mendez, Carlatan Campus, Philippines

Assoc. Prof. Binbin Xiang, Xinjiang Astronomical Observatory, China

Assoc. Prof. Janelli M. Mendez, Lorma Colleges – Carlatan Campus, Philippines

Dr. Zhou Shengang, Beijing Haawking Technology Company Limited, China

Dr. Wen-Cheng Lai, National Taiwan University of Science and Technology, Taiwan

Dr. Eduardo Rodrigues, The School of Design, Management and Production Technologies of Northern Aveiro, Portugal

Dr. Bo Liu, Beijing University of Technology, China

Dr. Kai Luo, Analog IC Design Center, Sichuan Institute of Solid-State Circuits, China

Dr. Wang Wei, The Second Research Institute of CAAC, Chengdu, China

Dr. Xu Gaofeng, China Academy of Electronics and Information Technology, China

Call for paper

Submission Topics

Track 1: Antennas and Microwaves
Track 2: Electronics Materials and Devices
Track 3: Communication and Networks
Track 4: Power and Electrical Engineering
Track 5: Aerospace & Electronics Systems
Track 6: Electronics Applications
Track 7: Internet of Things
Track 8: Embedded System
Track 9: AI and Applications
Track 10: Control and Robotics
Track 11: Signal Processing

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Important Date
  • Conference Date

    May 07

    2021

    to

    May 10

    2021

Sponsored By
IEEE
Supported By
Sichuan Institute of Electronics
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