Introduction

It is our pleasure to extend a warm welcome to all delegates to participate in 2024 7th International Conference on Electronics Technology (ICET) which is yearly held at Chengdu, China. ICET 2024 will be from May 17th to 20th (Friday to Monday). It is co-sponsored by Sichuan Institute of Electronics and IEEE, technically co-sponsored by Chengdu Section, Chengdu Section AP/EMC Chapter, Chengdu Section SP Chapter, IEEE Chengdu Section SSC/CAS Joint Chapter, Sichuan Institute of Electronics, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc. 

The primary aim of ICET conference is to offer an academic platform for senior and young scientists worldwide to exchange research ideas, share knowledge, and discuss developments and experiences in the field of electronics, micro/nanoelectronics technology, and electronic packaging. The conference creates a multicultural atmosphere conducive to collaboration and learning. The other key aim of ICET is to provide postgraduate students with the opportunity to present their research findings to experts from academia and industry. This allows students to receive scholarly feedback and gain valuable insights. Additionally, the conference serves as a platform for university academics and industry professionals to engage with the technical community, share experiences, and benefit from the latest technological advancements presented at the event. We sincerely hope that all delegates can have fruitful and effective deliberations during the conference, leading to increased international cooperation.

Committee

ICET 2024 Organization

Honorary Chair 

Longjiang Deng, University of Electronic Science and Technology of China (Academician of Chinese Academy of Engineering)

Advisory Chair 

Lalit Kumar Goel, Nanyang Technological University, Singapore (Fellow, IEEE)

Conference Chairs 

Yuan Lin, University of Electronic Science and Technology of China

Shiwen Yang, University of Electronic Science and Technology of China (Fellow, IEEE)

Kama Huang, Sichuan University | Vice Chairman, Sichuan Institute of Electronics

Conference Co-chairs 

Yuhua Cheng, Peking University (Fellow, IEEE)

Jiangtao Luo, Chongqing University of Posts and Telecommunications

Liangyin Chen, Sichuan University

Cui Meng, Zhejiang University

Program Chairs 

Frank He, Peking University

Gang Feng, University of Electronic Science and Technology of China

Weihao Hu, University of Electronic Science and Technology of China

Hui Li, University of Electronic Science and Technology of China

Weida Hu, Shanghai Institute of Technical Physics, Chinese Academy of Sciences

Haiying Dong, Lanzhou Jiaotong University

Junran Zhang, Sichuan University

Program Co-chairs 

Tao Jin, Fuzhou University

Xihua Zou, Southwest Jiaotong University

Xinyu Zhu, Civil Aviation Flight University of China

Local Organizing Chairs 

Tao Xiang, Secretary-General of Sichuan Institute of Electronics

Yongbo Liao, University of Electronic Science and Technology of China

Local Organizing Committee 本地组织委员

Kaikai Xu, University of Electronic Science and Technology of China

Bo Zhang, Chengdu Technological University

Publication Chair 

Maoshen Tan, Southwest Petroleum University, China

Xinyu Wang, Sichuan Institute of Electronics, China

Industry Liaison Chair 

Tao Li, Xi'an University of Posts and Telecommunications

Treasurer 

Jihang Deng, Sichuan University, China

 

Technical Program Committees 

Tianming Ma, Shanghai University of Engineering Science, China

Kai Wang, Southern University of Science and Technology

Zhongjie Guo, Xi'an University of Technology, China

Wang Yang, Xinjiang University, China

Jie Liu, Beijing University of Technology, China

Zhiwei Li, National University of Defense Technology, China

Jianjun Yang, University of North Georgia, Oakwood, USA

Li Xiang, Guilin University of Electronic Technology Guilin, China

Janelli M. Mendez, Lorma Colleges – Carlatan Campus, Philippines

Jun Wu, National University of Defense Technology, China

Wen-Sheng Zhao, Hangzhou Dianzi University, China

Changjiang Zhang, BNU-HKBU United International Colloge, China

Jian Zhu, Nanjing University, China

Guangnan Zhou, Crosslight Software Inc, Canada

Li Nannan, China Academy of Engineering Physics, China

Yu Xiao, Sun Yat-Sen University, Guangzhou, China

Zhaofeng Zhang, Shanghai Advanced Research Institute, Chinese Academy of Sciences Shanghai, China

Wang Yang, Xiangtan University, China

Wang Yuan, Peking University, China

Alireza Baghai-Wadji, University of Cape Town, South Africa

Jian Lv, UESTC, China

Teo Tee Hui, Singapore University of Technology and Design, Singapore

Somchat Sonasang, Nakhon Phanom University, Thailand

Donglin Wang, Zhengzhou University of Light Industry, China

Abdulati Abdullah, Azzaytuna University, Libya

Sheik Muhammed, University of Brunei, Brunei

Zhang Jinping, University of Electronic Science and Technology of China, China

Xinrong An, TCL Communication (Ningbo) Co., Ltd, China

Guanghu Jin, National University of Defense Technology, China

Ang Boon Chong, Intel, Malaysia

Hai-Wu Lee, Xiangsihu College of Guangxi University for Nationalities, China

Jinlong Li, Shanghai Institute of Measurement and Testing Technology, China

Chunyan Jiang, Shandong University of Political Science and Law, China

Zhiping Wan, Guangzhou Xinhua University, China

Guojun Jiang, East China University of Science and Technology, China

Lican Huang, Hangzhou DomainZones Technology Co.,Ltd.

Liao Wugang, Shenzhen University, China

Deshuang Zhao, University of Electronic Science and Technology of China, China

Hui Hou, Wuhan University of Technology, China

Issa Etier, Hashemite University, Jordan

Jinyan Wang, Peking University, China

Shiwen Lei, University of Electronic Science and Technology of China, China

Jianhong zhang, North China University of Technology, China

Yu Lu, Shenzhen Technology University, China

Yu Hongyu, Southern University of Science and Technology, China

TSUNG-MING LO, Nanfang College, China

Zhengchun Peng, Shenzhen University, China

Hailong Jiao, Peking University Shenzhen Graduate School, Shenzhen, China

 Yi Luo, Micro/Nano Fabrication Laboratory, Microsystem & Terahertz Research Center Chineses Academy of Engineering Physics Chengdu, China

Zhou Hang, Peking University Shenzhen Graduate School, Shenzhen, China

Wang Wei, The Second Research Institute of CAAC, China

Xiaofeng Zhao, Xi'an High Tech Institute, China

Weifeng Sun, Southeast University

Qing Shen, Beijing Institute of Technology, China

Bo Qiu, Hebei University of Technology, China

Ahmed Boutejdar, German Research Foundation DFG, Microwave and Communication Engineering, Germany

Hao Wu, Beijing Jiaotong University, China

Dake Tian, Shenyang Jianzhu University, China

Bowen Xing,Shanghai Ocean University, China

Zhiyu Xi,Beihang University, Australian

Haldun M. Ozaktas, Bilkent University, Turkey

Guofeng Jiang, Air Force Engineering University, China

Peng Chen, Southeast University, China

Yong Luo, Shanghai University, China

Xi Wang, Xi'an University of Technology, China

Wai Tung Ng, University of Toronto, Canada

Mohd Sharizal Abdul Aziz, Universiti Sains Malaysia, Malaysia

Suhana Binti Mohd Said, University of Malaya, Malaysia

Niansong Mei, Shanghai Advanced Research Institute, Chinese Academy of Sciences, China

Muhammad Murtadha Othman,Universiti Teknologi MARA,Malaysia

Nuo Xu, National University of Defense Technology

Minghui Zhao, Tongji University & China Coal Technology & Engineering Group Shanghai Co., Ltd.

Guanghui Wang, Toronto Metropolitan University,Canada

Kok Chiang Liang, Newcastle Australia Institute of Higher Education

Muhammad Arshad Shehzad Hassan,The University of Faisalabad, Pakistan

Longjie Yu, TCL Communication (Ningbo) Co., Ltd, China

Zhifeng Zhang, Zhengzhou University of Light Industry, China

Yunqi Hao, Zhengzhou University of Light Industry, China

Zhang Shiling, State Grid Chongqing Electric Power Company, China

Chenhui Wang, Hydrogeology and Environmental Geology Survey, CGS, China

Lianggui Liu, Zhejiang Shuren University, China

Fengjuan Wang, Xi'an University of Technology, China

Yilin Sun, Beijing Institute of Technology, China

Call for paper

Important date

2023-12-20
Draft paper submission deadline

Track 1: Antennas and Microwaves

Track 2: Electronics Materials and Devices

Track 3: Communication and Networks

Track 4: Power and Electrical Engineering

Track 5: Aerospace & Electronics Systems

Track 6: Electronics Applications

Track 7: Internet of Things

Track 8: Embedded System

Track 9: AI and Applications

Track 10: Control and Robotics

Track 11: Signal Processing

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Important Date
  • Conference Date

    May 17

    2024

    to

    May 20

    2024

  • Dec 20 2023

    Draft paper submission deadline

Sponsored By
Chengdu Section
Chengdu Section AP/EMC Chapter
Chengdu Section SP Chapter
IEEE Chengdu Section SSC/CAS Joint Chapter
Sichuan Institute of Electronics