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Following the success of previous IEEE ICCS, 2021 IEEE 3rd International Conference on Circuits and Systems will take place in Chengdu, China, during Oct. 29-31, 2021. ICCS 2021 is sponsored by IEEE, hosted by University of Electronic Science and Technology of China.

ICCS is an international networking platform for researchers in the highly active fields of theory, design and implementation of circuits and systems, to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the area, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.

Sponsor Type:5


Vladimir Terzija, Shandong University, China (IEEE Fellow)


Letian HuangUniversity of Electronic Science and Technology of China
Esteban Tlelo-CuautleNational Institute of Astrophysics, Optics and Electronics, INAOE


Hideharu AmanoKeio University
Xiaohang WangSouth China University of Technology
Wang KangBeihang University
Jayakumari. JMar Baselios College of Engineering and Technology


Qun ZhouSichuan University


Wei JiangUniversity of Electronic Science and Technology of China
Hai Wang, University of Electronic Science and Technology of China
Qihong HuangChengdu University of Information Technology


Zhang TianSichuan University


Meng ZhangSoutheast University
Tae Hyoung KimNanyang Technological University


Yong ChenUniversity of Macau


Bo ZhaoZhejiang University


Huanhuan LiuSichuan University


Anthony KongHong Kong Design Institute
Ce Zhou ZhaoXi’an Jiaotong-Liverpool University
Chi-Seng LamUniversity of Macau
Chong LiUniversity of Glasgow, UK
D. G. LiuFeng Chia University
Daniel Mueller-GritschnederTechnische Universitaet Muenchen
David HicksTexas A&M University
Francesco PonzioPolytechnic University of Turin
Haibing WangHohai University
Hailong JiaoPeking University Shenzhen Graduate School
Haiying YuanBeijing University of Technology
Hao GaoEindhoven University of Technology
Haruo KobayashiGunma University
M. C. WangMinghsin University of Science and Technology
Mo HuangUniversity of Macau
Paul ZhouAnalog Devices
Shagun BajoriaEindhoven university of Technology
Sijun DuDelft University of Technology
Smitha K. G.Nanyang Technological University
Wei LiuChongqing University of Technology
Wen-Shiung LourNational Cheng Kung University
Xiangyu MengSUN YAT-SEN University
Xiaohang WangSouth China University of Technology
Xiaozong HuangCETC
Yongbing HuAnhui University
Zhiguo YuJiangnan University

Call for paper

All submissions must describe original research, not published or currently under review for another workshop, conference, or journal. All accepted papers will be published by conference proceedings.

Submission Topics

We invite submissions of high-quality papers describing fully developed results or ongoing work on the following topics and related areas, but are not limited to:

 Analog signal processing
 Analog circuits and filters
 Switched capacitor and switched current techniques
 Analog and mixed signal processing
 Data conversion and sigma-delta modulation
 Low-power and low-voltage circuits
 Radio frequency circuits
 Log-domain circuits
 Visual signal processing and communications
 Linear and nonlinear circuits and systems
 Chaos and applications
 Distributed circuits and systems
 Power electronics and systems
 Biomedical circuits and systems

 Analog and digital ICs
 Low power design
 VLSI physical design
 Testing: analog, digital and mixed
 High level synthesis and hardware/software co-design
 Modelling, simulation and CAD tools
 Microsystems and applications
 Processor architectures
 Deep sub/micron design
 Information theory
 Coding and modulation
 Turbo codes and iterative decoding
 Equalization, synchronization and channel estimation
 Space-Time coding and processing
 Multiple access techniques


Full Paper

The manuscript in double-column format, up to 10 pages. Manuscripts must be written in English and follow the instructions at Manuscript Formatting and Templates.
To ensure the high quality of the accepted papers, all submissions will be peer-reviewed. Please only submit original material where copyright of all parts is owned by the authors declared and which is not currently under review elsewhere.
Registered and presented papers will be included in conference proceedings.


For those papers do not want to be published but presenting and discussing at the conference, you can submit an abstract first, for presentation only. Your abstract will not be published but only included in the conference program book.

Submission Instructions
  • Full Paper Template;
  • Abstract Template;

For any questions, please send email to Dr. Tina T. Wang via

Poster/Oral Presentation

Accepted articles will be invited for as oral or poster presentation, depending on the nature and quality of the paper.

Important Dates
  • Submission Deadline: Before 30 May, 2021
  • Notification: 30 June, 2021
  • Registration Deadline: 20 July, 2021
  • Conference dates: 29-31 October, 2021
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Important Date
  • Conference Date

    Oct 29



    Oct 31


Sponsored By
Chengdu Section CEDA Chapter
Supported By
University of Electronic Science and Technology of China
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