Introduction

Following the success of previous ICCS, 2024 6th International Conference on Circuits and Systems will take place in Chengdu, China during September 20-23, 2024. ICCS 2024 is co-sponsored by University of Electronic Science and Technology of China and IEEE, hosted by University of Electronic Science and Technology of China, and patroned by Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, Fudan University (China), Auckland University of Technology(New Zealand), Zhejiang University (China), INAOE.

ICCS is an international preeminent forum for reporting technological breakthroughs in the areas of circuits and systems from theory, design and implementation aspects. The congress has the focus on the frontier topics in the theoretical and applied engineering.

Committee
CONFERENCE CHAIRS
Xinglai Ge, Southwest Jiaotong University
Weixin Gai, Peking University
Anquan Jiang, Fudan University
 
CONFERENCE CO-CHAIRS
Yuehang Xu, University of Electronic Science and Technology of China, China
Xiaohang Wang, Zhejiang University
 
PROGRAM CHAIRS
Letian Huang, University of Electronic Science and Technology of China, China
Jayakumari J., Mar Baselios College of Engineering and Technology
Yi Zou, South China University of Technology
Haruo Kobayashi, Gunma University, Japan
Jeff Kilby, Auckland University of Technology, New Zealand
 
PROGRAM CO-CHAIRS
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou
Srikrishna C. Bodepudi, Zhejiang University, China
Esteban Tlelo-Cuautle, INAOE
 
TRACK CHAIRS
Maliang Liu, Xidian University
Gengen Liu, Fuzhou University
Jixin Zhang, Hubei University of Technology
Yibo Fan, Fudan University
Jing Jin, Shanghai Jiao Tong University
Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences
Haoting Shen, Zhejiang University
Zhangyong Chen, University of Electronic Science and Technology of China
Guohua Zhou, Southwest Jiaotong University
Dandan Ding, Hangzhou Normal University
Yijiu Zhao, University of Electronic Science and Technology of China
 
PUBLICITY CHAIRS
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou
Shuman Mao, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou
 
PUBLICATION CHAIR
Ling GONG, Southwest Medical University, China
Man XU, University of Electronic Science Technology of China, China
 
FINANCE CHAIR
Biao Pan, Beihang University

 

TECHNICAL PROGRAM COMMITTEES
  • Peng Feng, State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, China
  • Weijun Luo, Institute of Microelectronics of the Chinese Academy of Sciences, China
  • Minglei Tong, Shanghai University of Electric Power, China
  • Jiarui Chen, Fuzhou University, China
  • Deming Zhang, Hefei Innovation Research Institute, Beihang University, China
  • Guohe Zhang, Xi'an Jiaotong University, China
  • Yun Yin, Fudan University, China
  • Zhiguo Yu, Jiangnan University, China
  • Peng Liu, Guangdong University of Technology, China
  • Ziran Zhu, National ASIC System Engineering Center, Southeast University, China   
  • Xianyang Jiang, Wuhan University, China 
  • Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences & Center of Materials Science and Optoelectronics Engineering & School of Integrated Circuits, University of Chinese Academy of Sciences, China 
  • Yuan Gao, Southern University of Science and Technology, China
  • Runxi Zhang, East China Normal University, China
  • Yushi Zhou, Lakehead University, Canada
  • Haruo Kobayashi, Gunma University, Japan
  • Paul Zhou, Analog Devices, USA
  • Leijun Xu, Jiangsu University, China
  • Xiaotao Jia, Beihang University, China
  • Wei Liu, Chongqing University of Technology, China
  • Meilin Wan, Hubei University, China
  • Kai Xu, King's College London, UK
  • Xiaoying Deng, Shenzhen University, China
  • Xinfei Guo, University of Michigan – Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, China
  • Leilei Huang, Institute of Microelectronic Circuits and Systems, East China Normal University, China
  • Xiaozong Huang, CETC, China
  • Mei Jiang, Shenzhen University, China
  • Chenggang Yan, Nanjing University of Aeronautics and Astronautics, China
  • Yong Jia, Chengdu University of Technology, China
  • Ljiljana Trajkovic, Science Simon Fraser University, Canada
  • Hao Gao, Eindhoven University of Technology, Nederland
  • Na Yan, Fudan University, China
  • Sharul Kamal Bin Abdul Rahim, University Teknologi, Malaysia
  • Yan Li, Institute of Technology and International Standard, USA
  • Zuochang Ye, Tsinghua University, China
  • Dawei Li, South Central University for Nationalities, China
  • Zou huan, University of Electronic Science and Technology of China, China
  • Hui Chen, University of Electronic Science and Technology of China, China
  • Smitha K. G., Nanyang Technological University, Singapore
  • Jie Han, University of Alberta, Canada
  • Hailong Jiao, Peking University Shenzhen Graduate School, China
Call for paper

Important date

2024-04-30
Draft paper submission deadline

All submissions must describe original research, not published or currently under review for another workshop, conference, or journal. All accepted papers will be published by conference proceedings. We invite submissions of high-quality papers describing fully developed results or ongoing work on the following topics and related areas, but are not limited to:

Track 1: Analog and Nonlinear Circuits Design

  • General Analog Circuits
  • ADCs /DACs
  • PLL & Clock Generators
  • Chaos and Applications
  • Dynamic Nonlinear Circuits

 

Track 2: VLSI Design & Electronic Design Automatic

  • System Level Modeling & Verification
  • High Level Synthesis
  • Formal Verification
  • Hardware/Software Co-Design
  • Application Driven Accelerators Design & Domain-Specific Processor
  • FPGA based Design & Heterogynous System

 

Track 3: Circuits and Systems for Signal Processing

  • Circuits and Systems for Image Processing
  • Circuits and Systems for Audio & Video Analysis /Recognition/ Reconstruction
  • Biomedical Image Processing System
  • Body and Brain Interfaces
  • Circuits and Systems for Radar Signal Processing
  • Circuits and Systems for Signal Detection

 

Track 4: RF & Communication Circuits

  • Advanced RF Building Blocks
  • Wireline Communication Interfaces
  • Wireless Transmitters, Receivers, and Transceivers
  • Circuits and Systems for Equalization, Synchronization & Channel Estimation
  • Circuits and Systems for Coding and Modulation

 

Track 5: Design for Test & Reliability

  • SoC Test Methodology
  • Analog & Mixed Signal Circuits Test
  • Fault Tolerant Design
  • Aging Modeling & Mitigation
  • Hardware Security

 

Track 6: Power Electronic Circuits

  • Distributed Circuits and Systems
  • Power Line Analyzing & Modeling
  • Energy Storage Circuits
  • Energy Sources & Power Converter
  • Circuits and Systems for Smart Grid

 

Track 7: Control Aspects of Circuits and Systems

  • Circuits and Systems for Automated Driving & Automated Vehicle
  • Circuits and Systems for Motor Control
  • Mechatronics
  • Control Theory Application in Circuits and Systems
  • Adaptive Circuits and Systems

 

Track 8: Circuits and Systems for Instrumentation and Measurement

  • Sensors and Sensor Interfaces
  • Circuits and Systems for Instruments
  • Circuits and Systems for Fault Detection & Diagnosis
  • Circuits and Systems for Data Acquisition & Confusion
  • Circuits and Systems for Measurement & Positioning
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Sep 20

    2024

    to

    Sep 23

    2024

  • Apr 30 2024

    Draft paper submission deadline

Sponsored By
Chengdu Section
University of Electronic Science Technology of China