Abstract List
My SubmissionsImportant Date
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Conference Date
Jul 28
2008
toJul 31
2008
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Apr 25 2008
Abstract Submission Deadline
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Jun 27 2008
Draft paper submission deadline
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Jul 31 2008
Registration deadline
Sponsored By
国际电子与电气工程师协会元件制造与封装分会(IEEE-CPMT)
中国电子学会生产技术学分会(CIE-CEPS)
中国电子学会
中国电子学会生产技术学分会(CIE-CEPS)
中国电子学会
Organized By
复旦大学
Contact Information
Previous Conferences
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2026-08-05 China Xi'an
2026 27th International Conference on Electronic Packaging Technology (ICEPT) -
2026-08-05 China Xi'an
第27届电子封装技术国际会议 -
2026-08-05 China Xi'an
2026年电子封装技术国际会议ICEPT -
2025-08-09 China 上海市(Shanghai)
第二十六届电子封装技术国际会议（ICEPT 2025） -
2025-08-05 China Shanghai
2025 26th International Conference on Electronic Packaging Technology (ICEPT) -
2022-08-10 China Dalian
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) -
2021-08-11 China Xiamen
2021 22nd International Conference on Electronic Packaging Technology -
2020-08-12 China 广州市(Guangzhou)
2020年第21届电子封装技术国际会议 -
2018-08-08 China
2018 19th International Conference on Electronic Packaging Technology -
2017-08-16 China 哈尔滨市
第十八届电子封装技术国际会议
