2017 IEEE International Solid- State Circuits Conference (ISSCC)

ANALOG: Amplifiers, comparators, oscillators, filters, references, regulators, DC-DC converters; power control and management circuits, energy-harvesting circuits; nonlinear analog circuits; digitally-assisted analog circuits.

DATA CONVERTERS: Nyquist-rate and oversampling A/D and D/A converters; time-to-digital converters.

DIGITAL ARCHITECTURES & SYSTEMS: General-purpose microprocessors, micro-controllers, application processors, graphics processors, network processors, digital baseband processors, multi-mode communications systems, video and multimedia, machine-learning/deep-learning systems, neuromorphic systems, cryptographic systems, special function acceleration, systemlevel power management, near-threshold/subthreshold processing for wearable/IoE applications, digital architectures and systems for emerging applications (e.g. virtual reality, artificial intelligence, autonomous vehicles). DIGITAL CIRCUITS: Building blocks for 2D/3D SoC: including special-purpose digital circuits, intra-chip communication circuits, clock distribution techniques, soft-error and variation-tolerant circuits. Circuits for power management in digital applications: including voltage regulators, adaptive digital circuits, digital sensors; Sub-threshold and Near-threshold circuits; PLLs for digital clocking applications. Circuits for neuro-computing; Hardware security circuits (e.g. PUF).

IMAGERS, MEMS, MEDICAL, & DISPLAYS: Image sensors and companion chips; image-sensor SoCs; MEMS for analog, RF, timing and sensor applications; smart sensors, thermal sensors, ultrasonic sensors; sensor- and transducer-interface circuits; neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; environmental and wearable electronics; biomedical SoCs; display and touch electronics, flexible displays, and displays with integrated sensing functionality.

MEMORY: Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O interfaces; memories based on phase-change, magnetic, spin-transfer-torque, ferroelectric, and resistive materials; array architectures and circuits to improve low-voltage operation, power reduction, reliability, and fault tolerance; memory subsystem enhancements, including in-memory logic functions.

RF CIRCUITS and WIRELESS SYSTEMS*: Building blocks and complete solutions at RF, mm-Wave, and THz frequencies for receivers, transmitters, frequency synthesizers, transceivers, SoCs, and SiPs. Innovative circuit-level and system architecture solutions for established wireless standards and future systems or applications.

TECHNOLOGY DIRECTIONS: Emerging IC and system solutions for: biomedical, sensor interfaces, analog signal processing, power-management, computation, data storage, security, and communication; non-silicon-, carbon-, organic-, metal-oxide-, compound-, wide-bandgap-semiconductor-, and nano-electronics circuits; flexible, large-area, stretchable, and printable electronics; 3D integration; spintronics; quantum, optical, new-device, and non-transistor-based circuits.

WIRELINE: Receivers/transmitters/transceivers for wireline systems, including backplane transceivers, optical links, chip-to-chip communications, 2.5/3D interconnect, copper cable links, and equalizing on-chip links; exploratory I/O circuits for advancing data rates, power efficiency, and equalization; building blocks for wireline transceivers (such as AGCs, analog and ADC/DAC-based front ends, equalizers, clock generation, and distribution circuits including PLLs, line drivers, and hybrids).