Introduction

The nineth IEEE International Memory Workshop (IMW) will be held at the Hyatt Regency, Monterey, California from Sunday May 14th though Wednesday May 17th, 2017. This conference brings the memory community together in a workshop environment to discuss the memory process and design technologies, applications, market needs and strategies. It is sponsored by the IEEE Electron Devices Society and meets annually in May.
Although it is the nineth IMW meeting to be held this year, it has a long history of Non-Volatile Semiconductor Memory Workshops (NVSMW) dating back to 1976. In 2008, NVSMW and the International Conference on Memory Technology and Design (ICMTD) merged to incorporate both the volatile and non-volatile memory aspects in one forum while maintaining the workshop experience. And the scope was extended from non-volatile memory technology and design, which had been successfully discussed in more than 30 years of NVSMW, to the other memory technologies, which were the focus of ICMTD.
The IMW is a unique forum for specialists in all aspects of memory (nonvolatile & volatile) microelectronics and people with different backgrounds who wish to gain a better understanding of the field. The morning and afternoon technical sessions are organized in a manner that provides ample time for informal exchanges amongst presenters and attendees. The evening panel discussions will address hot topics in the memory and memory system field. 

Call for paper

Submission Topics

Papers are solicited in all aspects of semiconductor memory technology (Flash, DRAM, SRAM, PCRAM, RRAM, MRAM, embedded memory, and other NV memories), including but are not limited to:

  • Device Physics

  • Quality and Reliability    

  • Cell Design

  • New Concepts and Technologies    

  • Circuit Design and Algorithm

  • SSD/Mobile, 2D/3D NAND, NOR, Storage Class Memory, etc...    

  • Processing & Testing

  • Programmable Logic    

  • New concepts for legacy and emerging application

  • New Applications

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Important Date
  • Conference Date

    May 14

    2017

    to

    May 17

    2017

Sponsored By
IEEE
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