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Introduction

TIME AND PLACE
The Congress will be held at Hangzhou Huagang HNA Resort (1 Yang Gong Di) from December 8 to 10, 2017, Hangzhou, China.

 
AIM
The objectives of the Congress are to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the country who are involved in the field of thermal stresses to exchange ideas and to extend further cooperation among participants. The Congress should forge cooperative links between researches and engineers by bringing them to one place where they present their achievements and conduct discussions. 

Call for paper

Important date

2017-10-31
Abstract submission deadline
2017-11-10
Final paper submission deadline

Submission Topics

This is a conference on thermal stresses and related topics, with particular focus on the following, but not limited to them:

  • Heat Conduction, Convection and Radiation Problems

  • Thermoelasticity and Generalized Thermoelasticity

  • Multi-field Coupling Mechanics of Thermodynamics

  • Thermoplastic Theory and Applications

  • Thermal Vibration and Thermal Shock

  • Thermal Stresses in

    • Contact Mechanics

    • Dynamic Problems

    • Fracture and Fatigue

    • Micro-Nano Scale

  • Thermal Protection and Thermal Shielding

  • Materials under High Temperature

  • Mechanical Properties of Thermoelectric materials

  • Control of Thermal Structures

  • Encapsulation and Thermal Management of Electronic Devices

  • Other Thermodynamic Problems

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Important Date
  • Conference Date

    Dec 08

    2017

    to

    Dec 10

    2017

  • Oct 31 2017

    Abstract Submission Deadline

  • Nov 10 2017

    Final Paper Deadline

  • Dec 10 2017

    Registration deadline

Sponsored By
中国力学学会
Organized By
浙江省软体机器人与智能器件研究重点实验室
浙江大学应用力学研究所
中国力学学会电子电磁器件力学工作组
浙江省力学学会固体力学专业委员会
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