TIME AND PLACE
The Congress will be held at Hangzhou Huagang HNA Resort (1 Yang Gong Di) from December 8 to 10, 2017, Hangzhou, China.
AIM
The objectives of the Congress are to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the country who are involved in the field of thermal stresses to exchange ideas and to extend further cooperation among participants. The Congress should forge cooperative links between researches and engineers by bringing them to one place where they present their achievements and conduct discussions.
This is a conference on thermal stresses and related topics, with particular focus on the following, but not limited to them:
Heat Conduction, Convection and Radiation Problems
Thermoelasticity and Generalized Thermoelasticity
Multi-field Coupling Mechanics of Thermodynamics
Thermoplastic Theory and Applications
Thermal Vibration and Thermal Shock
Thermal Stresses in
Contact Mechanics
Dynamic Problems
Fracture and Fatigue
Micro-Nano Scale
Thermal Protection and Thermal Shielding
Materials under High Temperature
Mechanical Properties of Thermoelectric materials
Control of Thermal Structures
Encapsulation and Thermal Management of Electronic Devices
Other Thermodynamic Problems
Dec 08
2017
Dec 10
2017
Abstract Submission Deadline
Final Paper Deadline
Registration deadline
2025-04-18 China Xi'an
第七届全国热应力大会2019-08-01 China 杭州市
第三届全国热应力大会2015-12-12 China 南京市
第一届全国热应力大会
Submit Comment