Description

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.

Schedule

Deadline for Abstracts September 17, 2018
Notification of Acceptance October 15, 2018
Draft Paper Submission December 17, 2018
Reviews Returned February 4, 2019
Final Paper Submission March 4, 2019
Author Registration Deadline April 1, 2019
ITherm Conference Begins May 28, 2019

Call for paper

Important Dates

Draft paper submission deadline:2018-09-03

Call for paper description

Original papers are solicited in the following general areas of interest (but not limited to):

COMPONENT-LEVEL THERMAL MANAGEMENT

  • Transistor Technology
  • 2.5D / 3D Packaging
  • Embedded Cooling
  • Hotspot and Impingement Cooling
  • Thermal Interface Materials and Heat Spreaders
  • Thermoelectric and Peltier Devices
  • Heat Pipes, Vapor Chambers and Thermosyphons
  • Single / Two-phase Cold Plates and Heat Sinks
  • RF and Power Electronics
  • LEDs and Photovoltaics
  • Pulsed Power Dissipation

SYSTEM-LEVEL THERMAL MANAGEMENT

  • Air Cooling Techniques and Heat Exchangers
  • Liquid Cooling Solutions
  • Immersion Cooling and Refrigeration
  • Pumps, Compressors, Fans and Blowers
  • Phase Change Materials
  • Automotive, Batteries and Thermal Storage
  • Mobile and Internet of Things
  • Telecommunication Systems
  • Space and Aerospace
  • Data Center Thermal Management

EMERGING TECHNOLOGIES & FUNDAMENTALS

  • Convection in Microchannels, Microgaps & Jets
  • Pulsating / Oscillating and Non-Conventional HeatPipes
  • Thermal Transport in Nanotechnologies
  • Novel Materials and Fabrication Techniques
  • Measurement and Instrumentation Techniques
  • Numerical Methods, Nano-to-Macro Scale
  • Experimental Methods, Nano-to-Macro Scale
  • Prognostic Health Management and Reliability Analysis
  • Flexible Electronics
  • Additive Manufacturing

MECHANICS & RELIABILITY

  • Thermo-Mechanical Modeling and Simulation
  • Mechanics and Reliability of Solder Joints and Interconnects
  • Materials Characterization, Processing, and Constitutive Models
  • Failure Mechanics, Fatigue, and Damage Modeling
  • Measurement of Deformations, Strains and Stresses
  • Shock, Drop and Vibrational Analysis
  • TSV / 3D Reliability and Packaging
  • Mechanics in Assembly and Manufacturing
  • Applied Reliability andFailure Analysis
  • Process-Structure-Property Relations / Multi-Scale Analyses
  • Accelerated Stress Testing and Modeling
  • Lifetime Prognostics and Condition Monitoring

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Contact information

  • jsuhling@auburn.edu

Sponsored By

  • IEEE Electronics Packaging Society