Description

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.

Call for paper

Description

Original papers are solicited in the following general areas of interest (but not limited to):

COMPONENT-LEVEL THERMAL MANAGEMENT

  • Transistor Technology
  • 2.5D / 3D Packaging
  • Embedded Cooling
  • Hotspot and Impingement Cooling
  • Thermal Interface Materials and Heat Spreaders
  • Thermoelectric and Peltier Devices
  • Heat Pipes, Vapor Chambers and Thermosyphons
  • Single / Two-phase Cold Plates and Heat Sinks
  • RF and Power Electronics
  • LEDs and Photovoltaics
  • Pulsed Power Dissipation

SYSTEM-LEVEL THERMAL MANAGEMENT

  • Air Cooling Techniques and Heat Exchangers
  • Liquid Cooling Solutions
  • Immersion Cooling and Refrigeration
  • Pumps, Compressors, Fans and Blowers
  • Phase Change Materials
  • Automotive, Batteries and Thermal Storage
  • Mobile and Internet of Things
  • Telecommunication Systems
  • Space and Aerospace
  • Data Center Thermal Management

EMERGING TECHNOLOGIES & FUNDAMENTALS

  • Convection in Microchannels, Microgaps & Jets
  • Pulsating / Oscillating and Non-Conventional HeatPipes
  • Thermal Transport in Nanotechnologies
  • Novel Materials and Fabrication Techniques
  • Measurement and Instrumentation Techniques
  • Numerical Methods, Nano-to-Macro Scale
  • Experimental Methods, Nano-to-Macro Scale
  • Prognostic Health Management and Reliability Analysis
  • Flexible Electronics
  • Additive Manufacturing

MECHANICS & RELIABILITY

  • Thermo-Mechanical Modeling and Simulation
  • Mechanics and Reliability of Solder Joints and Interconnects
  • Materials Characterization, Processing, and Constitutive Models
  • Failure Mechanics, Fatigue, and Damage Modeling
  • Measurement of Deformations, Strains and Stresses
  • Shock, Drop and Vibrational Analysis
  • TSV / 3D Reliability and Packaging
  • Mechanics in Assembly and Manufacturing
  • Applied Reliability andFailure Analysis
  • Process-Structure-Property Relations / Multi-Scale Analyses
  • Accelerated Stress Testing and Modeling
  • Lifetime Prognostics and Condition Monitoring

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Important dates

  • Conference Dates

    29 May.

    2019

    TO

    31 May.

    2019

  • 03 Sep.

    2018

    Draft paper submission deadline

Contact information

  • jsuhling@auburn.edu