Introduction
AboutAerospace; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems; Transportation
Keywords:Thermal Management of Components and Systems,Mechanics and Reliability,Emerging Technologies,
Scope:The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
Sponsor Type:1
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Important Date
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Conference Date
May 30
2028
toJun 02
2028
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Jun 02 2028
Registration deadline
Sponsored By
Contact Information
Previous Conferences
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2031-05-27 United States Dallas
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2021-06-01 United States San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2020-05-26 United States Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2019-05-29 United States
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2018-05-29 United States
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2017-05-30 United States Orlando
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2016-05-31 United States Las Vegas, USA
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2014-05-27 United States
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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