Introduction

AboutAerospace; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems; Transportation
Keywords:Thermal Management of Components and Systems,Mechanics and Reliability,Emerging Technologies,
Scope:The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
Sponsor Type:1

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Important Date
  • Conference Date

    May 30

    2028

    to

    Jun 02

    2028

  • Jun 02 2028

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society