Introduction

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2021 will be held virtually. In addition to paper presentations and vendor exhibits, ITherm 2021 will include, keynote lectures by prominent speakers, invited technology talks, networking opportunities and a student design competition.

All papers will be peer reviewed and published in the ITherm proceedings.

Sponsor Type:1

Committee

Leadership Team

General Chair
Justin Weibel
Purdue University

Program Chair
Dustin Demetriou
IBM

Vice Program Chair
Satish Kumar
Georgia TechAshish Gupta

Communication Chair
Ashish Gupta
Intel Corporation

Component-Level Thermal Management

Chair
Kamal Sikka
IBM

Co-Chair
Stephanie-Allard
IBM

Co-Chair
Darin Sharar
Army Research Labs

Call for paper

Important date

2020-10-26
Draft paper submission deadline
2021-03-08
Final paper submission deadline

Submission Topics

Original manuscripts on Thermal and Thermomechanical Phenomena in Electronic Systems are welcome.

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Important Date

  • Conference Date

    Jun 01

    2021

    to

    Jun 04

    2021

  • Oct 26 2020

    Draft paper submission deadline

  • Mar 08 2021

    Final Paper Deadline

  • Jun 04 2021

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society
Contact Information
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