Abstract List
My SubmissionsImportant Date
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Conference Date
Aug 16
2017
toAug 19
2017
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Mar 31 2017
Abstract Submission Deadline
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Aug 19 2017
Registration deadline
Sponsored By
哈尔滨工业大学
Organized By
哈尔滨工业大学
Contact Information
Previous Conferences
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2022-08-10 China Dalian
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) -
2021-08-11 China Xiamen
2021 22nd International Conference on Electronic Packaging Technology -
2018-08-08 China
2018 19th International Conference on Electronic Packaging Technology -
2016-08-16 China Wuhan, China
2016 17th International Conference on Electronic Packaging Technology -
2016-08-01 China 武汉市
第十七届电子封装技术国际会议 -
2015-08-11 China 长沙市
第十六届电子封装技术国际会议 -
2014-08-12 China 成都市
The 15th International Conference on Electronic Packaging Technology -
2013-08-11 China 大连市
2013 International Conference on Electronics Packaging Technology -
2013-06-17 Australia
International Conference on Electronic Packaging Technology -
2009-08-10 China 北京市
2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT
