Organised by Fraunhofer Institute for Ceramic Technologies and Systems IKTS, EuroSimE 2017 will be hosted in the city of Dresden at the Dresden Westin Bellevue hotel.
Short courses will be offered for professional training on April 2, 2017.
Three days of technical sessions (April 3–5, 2017) for oral and poster presentations are planned, in parallel with an exhibition of suppliers of experimental characterization, simulation and optimization equipment demonstrating their latest features.
The best papers will be selected for publishing in Elsevier magazines on Microelectronics Reliability and Mechatronics.
Subjects
Multi-physics simulation (e.g. thermal, mechanical,
thermo-mechanical, coupled thermo-fluidic, coupled
electro-mechanics, fluid structure interactions)
Material characterisation, experiments and modelling
Integrated process modelling
Simulation-based optimisation, virtual prototyping in
product and process design
Advanced numerical and analytical simulation
methodologies and tools
Multiscale modelling and simulation
Compact modelling and model order reduction
Behavioural modelling
Experimental methods for validation of simulation
models
Failure analysis and failure mode extraction
Failure criteria and damage modelling for reliability
prediction
Prognostics and Health Monitoring
Additive Manufacturing 3D Printing, 3D packaging
Apr 02
2017
Apr 05
2017
2024-04-07 Italy Catania
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2018-04-15 France
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2016-04-17 France Montpellier, France
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2015-04-19 United States
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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