2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. All EuroSimE's aim to: promote further development and application of simulation methodologies and tools for the electronics industry, improve communication and exchange information between methodology & tool-developers and industry users, strengthen co-operation between industry, universities, and research institutes.