Abstract List
My SubmissionsImportant Date
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Conference Date
May 27
2031
toMay 30
2031
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Sep 20 2030
Abstract Submission Deadline
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May 30 2031
Registration deadline
Sponsored By
IEEE Electronics Packaging Society
Contact Information
Previous Conferences
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2028-05-30 United States Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2021-06-01 United States San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2020-05-26 United States Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2019-05-29 United States
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2018-05-29 United States
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2017-05-30 United States Orlando
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2016-05-31 United States Las Vegas, USA
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2014-05-27 United States
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
