Introduction
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
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Important date
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Important Date
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Conference Date
May 29
2018
toJun 01
2018
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Oct 16 2017
Abstract Submission Deadline
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Dec 08 2017
Draft Paper Acceptance Notification
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Feb 09 2018
Final Paper Deadline
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Feb 23 2018
Draft paper submission deadline
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Jun 01 2018
Registration deadline
Sponsored By
Contact Information
- Patrick Thompson
- pa******@ti.com
Previous Conferences
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2031-05-22 United States
2031 IEEE 81st Electronic Components and Technology Conference -
2030-05-26 United States Denver
2030 IEEE 80th Electronic Components and Technology Conference -
2028-05-29 United States
2028 IEEE 78th Electronic Components and Technology Conference -
2027-05-31 United States Las Vegas
2027 IEEE 77th Electronic Components and Technology Conference -
2021-06-01 United States
2021 IEEE 71st Electronic Components and Technology Conference -
2021-06-01 United States San Diego
2021 IEEE 71th Electronic Components and Technology Conference -
2020-05-26 United States Lake Buena Vista,USA
2020 IEEE 70th Electronic Components and Technology Conference -
2019-05-25 United States Las Vegas,USA
2019 IEEE 69th Electronic Components and Technology Conference -
2017-05-30 United States Orlando
2017 IEEE 67th Electronic Components and Technology Conference -
2016-05-31 United States Las Vegas, USA
2016 IEEE 66th Electronic Components and Technology Conference
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