Description

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation

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Important dates

  • Conference Dates

    29 May.

    2018

    TO

    01 Jun.

    2018

  • 16 Oct.

    2017

    Abstract submission deadline

  • 08 Dec.

    2017

    Draft paper acceptance notification

  • 09 Feb.

    2018

    Final paper deadline

  • 23 Feb.

    2018

    Draft paper submission deadline

Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com

Sponsored By

  • IEEE

Conference Series