Description

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation

Call for paper

Important Dates

Draft paper submission deadline:2018-02-23

Draft paper acceptance notification:2017-12-08

Abstract submission deadline:2017-10-16

Final paper submission deadline:2018-02-09

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Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com

Sponsored By

  • IEEE