Description

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2016 ECTC will be held at The Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA and co-located with ITHERM.

Call for paper

Topics of submission

Advanced Packaging
Session 1: Advances in Fan-Out Packaging
Session 7: 2.5 & 3D Process and Integration Technologies
Session 13: Substrate Embedding & Advanced Flip-Chip Packaging
Session 19: MEMS & Sensor Technologies
Session 25: Wafer-Level CSP & Heterogeneous Integration
Session 28: RF, Microwave and Millimeter Wave
Session 31: 3D Applications and Wafer Processing
High-Speed, Wireless & Components
Session 9: Design and Analysis of Power Delivery Systems
Session 21: High-Speed Systems: Design & Analysis
Session 28: RF, Microwave and Millimeter Wave
Session 33: Advances in RF Materials & Components
Emerging Technologies
Session 5: Novel Materials, Devices and 3D Interconnects
Session 18: Additive Fabrication Technologies for Packaging
Session 35: Wearable, Flexible, and Stretchable Electronics
Interconnections
Session 2: TSV Fabrication, Characterization and Reliability
Session 8: Innovations in TSV Interconnect and Bonding Technologies
Session 14: Advancement on Wirebond Process & Reliability
Session 20: Flip-Chip: Bonding, Materials, and Reliability
Session 26: Innovative Interconnects
Session 32: Novel Fan-Out Interconnections
Assembly & Manufacturing Technology
Session 3: Enhancement in Thermal Compression Bonding Processes
Session 15: Advanced Assembly Technology Solutions
Session 27: Advancement in 3D Handling & Packages
Session 32: Novel Fan-Out Interconnections
Materials & Processing
Session 4: Next Generation Substrates for Package Integration
Session 10: Novel Interconnect Materials
Session 16: Performance Enhanced Adhesives, Underfills, and TIMs
Session 36: 3D Materials & Processing
Thermal/Mechanical Simulation & Characterization
Session 6: Solder Joint Reliability Characterization and Modeling
Session 12: Electromigration, Warpage, and Material Characterization
Session 22: Mechanical Modeling and Characterization of Interposer & Wirebonds
Session 30: Thermo-Mechanical and Thermal Characterization
Session 34: 3D, TSV, and TGV Reliability & Characterization
Optoelectronics
Session 11: Optical Interconnects & 3D Photonics
Session 23: Transceivers and Silicon Photonic Modules
Applied Reliability
Session 17: Advancements in Characterization and Reliability Methods
Session 24: Reliability of Interconnects
Session 29: Advanced Reliability Applications
Session 34: 3D, TSV, and TGV Reliability & Characterization
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations

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Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com
  • +12145670660