2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Advanced Packaging
Session 1: Advances in Fan-Out Packaging
Session 7: 2.5 & 3D Process and Integration Technologies
Session 13: Substrate Embedding & Advanced Flip-Chip Packaging
Session 19: MEMS & Sensor Technologies
Session 25: Wafer-Level CSP & Heterogeneous Integration
Session 28: RF, Microwave and Millimeter Wave
Session 31: 3D Applications and Wafer Processing
High-Speed, Wireless & Components
Session 9: Design and Analysis of Power Delivery Systems
Session 21: High-Speed Systems: Design & Analysis
Session 28: RF, Microwave and Millimeter Wave
Session 33: Advances in RF Materials & Components
Emerging Technologies
Session 5: Novel Materials, Devices and 3D Interconnects
Session 18: Additive Fabrication Technologies for Packaging
Session 35: Wearable, Flexible, and Stretchable Electronics
Interconnections
Session 2: TSV Fabrication, Characterization and Reliability
Session 8: Innovations in TSV Interconnect and Bonding Technologies
Session 14: Advancement on Wirebond Process & Reliability
Session 20: Flip-Chip: Bonding, Materials, and Reliability
Session 26: Innovative Interconnects
Session 32: Novel Fan-Out Interconnections
Assembly & Manufacturing Technology
Session 3: Enhancement in Thermal Compression Bonding Processes
Session 15: Advanced Assembly Technology Solutions
Session 27: Advancement in 3D Handling & Packages
Session 32: Novel Fan-Out Interconnections
Materials & Processing
Session 4: Next Generation Substrates for Package Integration
Session 10: Novel Interconnect Materials
Session 16: Performance Enhanced Adhesives, Underfills, and TIMs
Session 36: 3D Materials & Processing
Thermal/Mechanical Simulation & Characterization
Session 6: Solder Joint Reliability Characterization and Modeling
Session 12: Electromigration, Warpage, and Material Characterization
Session 22: Mechanical Modeling and Characterization of Interposer & Wirebonds
Session 30: Thermo-Mechanical and Thermal Characterization
Session 34: 3D, TSV, and TGV Reliability & Characterization
Optoelectronics
Session 11: Optical Interconnects & 3D Photonics
Session 23: Transceivers and Silicon Photonic Modules
Applied Reliability
Session 17: Advancements in Characterization and Reliability Methods
Session 24: Reliability of Interconnects
Session 29: Advanced Reliability Applications
Session 34: 3D, TSV, and TGV Reliability & Characterization
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations