ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

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Important Dates

Draft paper acceptance notification:2020-12-11

Abstract submission deadline:2020-10-16

Final paper submission deadline:2021-02-12


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Contact information

  • Patrick Thompson

Sponsored By

  • IEEE