ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Call for paper
Draft paper acceptance notification：2020-12-11
Abstract submission deadline：2020-10-16
Final paper submission deadline：2021-02-12