Description
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Call for paper
Please check the above Conference Description for CFP information.
Any questions, please contact the conference organizer. The contact(s) can be found on the right Contact .
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Important dates
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Conference Dates
01 Jun.
2021
TO04 Jun.
2021
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16 Oct.
2020
Abstract submission deadline
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11 Dec.
2020
Draft paper acceptance notification
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12 Feb.
2021
Final paper deadline
Contact information
- Patrick Thompson
- patrick.thompson@ti.com
Sponsored By
- IEEE
Conference Series
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United States Lake Buena Vista,USA 2020/05/26-29
2020 IEEE 70th Electronic Components and Technology Conference -
United States Las Vegas,USA 2019/05/25-02
2019 IEEE 69th Electronic Components and Technology Conference -
United States Sheraton San Diego Hotel & Marina 2018/05/29-01
2018 IEEE 68th Electronic Components and Technology Conference -
United States Orlando 2017/05/30-02
2017 IEEE 67th Electronic Components and Technology Conference -
United States Las Vegas, USA 2016/05/31-03
2016 IEEE 66th Electronic Components and Technology Conference -
United States 2015/05/26-29
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) -
United States 2014/05/27-30
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) -
United States 2013/05/28-31
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)