Introduction
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
Sponsor Type:1
Committee
General Chair
Nancy Stoffel
GE Research
Vice General Chair
Rozalia Beica
AT&S
Program Chair
Ibrahim Guven
Virginia Commonwealth University
Assistant Program Chair
Karlheinz Bock
TU Dresden
Jr. Past General Chair
Christopher Bower
X-Display Company, Inc.
Sr. Past General Chair
Mark Poliks
Binghamton University
Sponsorship Chair
Wolfgang Sauter
Marvell Semiconductor, Inc.
Finance Chair
Patrick Thompson
Texas Instruments, Inc.
Publications Chair
Henning Braunisch
Intel Corporation
Publicity Chair
Eric Perfecto
IBM Research
Treasurer
Tom Reynolds
T3 Group LLC
Exhibits Chair
Alan Huffman
Micross Advanced Interconnect Technology
IT Coordinator
Florian Herrault
HRL Laboratories, LLC
Professional Development Course Chair
Kitty Pearsall
Boss Precision, Inc.
Conference Management
Lisa Renzi Ragar
Renzi & Company, Inc.
EPS Representative
Annette Teng
Promex Industries
Call for paper
Important date
Submission Topics
Highly rated abstracts are accepted for presentation at the ECTC conference. It is important that authors identify the subcommittees whose topic areas best fit their abstracts. Abstracts should include original and previously unpublished, non-confidential, and non-commercial information on new developments, technology, and knowledge in the areas including, but not limited to, those given below for each technical subcommittee：
Applied Reliability
Assembly and Manufacturing Technology
Emerging Technologies
Interconnections
Materials & Processing
Packaging Technologies
Photonics
RF, High-Speed Components & Systems
Thermal/Mechanical Simulation & Characterization
Interactive Presentations
All Comments
Important Date
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Conference Date
Jun 01
2021
toJul 04
2021
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Feb 28 2021
Draft paper submission deadline
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Jun 02 2029
Registration deadline
Sponsored By
Contact Information
- Ibrahim Guven
- ig******@vcu.edu
Previous Conferences
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2031-05-22 United States
2031 IEEE 81st Electronic Components and Technology Conference -
2030-05-26 United States Denver
2030 IEEE 80th Electronic Components and Technology Conference -
2028-05-29 United States
2028 IEEE 78th Electronic Components and Technology Conference -
2027-05-31 United States Las Vegas
2027 IEEE 77th Electronic Components and Technology Conference -
2021-06-01 United States
2021 IEEE 71st Electronic Components and Technology Conference -
2020-05-26 United States Lake Buena Vista,USA
2020 IEEE 70th Electronic Components and Technology Conference -
2019-05-25 United States Las Vegas,USA
2019 IEEE 69th Electronic Components and Technology Conference -
2018-05-29 United States
2018 IEEE 68th Electronic Components and Technology Conference -
2017-05-30 United States Orlando
2017 IEEE 67th Electronic Components and Technology Conference -
2016-05-31 United States Las Vegas, USA
2016 IEEE 66th Electronic Components and Technology Conference
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