Introduction

AboutComponents, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics
Keywords:Electronics Packaging,
Scope:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Sponsor Type:1

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Important Date
  • Conference Date

    May 26

    2030

    to

    Jun 01

    2030

  • Jun 01 2030

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society