2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Apr. 07 - 10, 2024

Hotel Four Points by Sheraton, Via Antonello da Messina 45, Aci Castello, Catania · Italy

Conference Offline Conference

0 Views

0 Comments

Program

Timezone：Asia/Beijing

Program Overview

Important Date

Conference Date

Apr 07

2024

to

Apr 10

2024
Oct 30 2023

Abstract Submission Deadline
Dec 15 2023

Abstract Notification of Acceptance
Apr 10 2024

Registration deadline

Sponsored By

IEEE Electronics Packaging Society
Technical University of Delft

Contact Information

H.******@tudelft.nl

Login to view full contact details

Previous Conferences

2018-04-15 France
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
2017-04-02 Germany Dresden
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
2016-04-17 France Montpellier, France
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
2015-04-19 United States
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)