Description

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2014 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.

Call for paper

Topics of submission

Advanced Packaging Session 1: Interposer Technologies Session 8: Flip Chip Packaging & Advanced Substrate Session 13: 3D Process Integration & Die Stacking Session 21: Wafer-Level & Fan-Out Packages Session 27: Sensors & MEMS Technologies

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Contact information

  • gislerhj.ECTC@mediacombb.net
  • +1-480-288-6660