International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification and validation, test (DFT, ATPG, and BIST), diagnosis, failure analysis and back to process, yield, reliability and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.

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Submission Topics

  • 3D/2.5D Test

  • Adaptive Test in Practice

  • ATE/Probe Card Design

  • Advances in Boundary Scan

  • Bring Up

  • Data Driven Methods

  • Data Exchange and Infrastructure

  • Defect-Oriented Testing

  • DFM and Test

  • Diagnosis

  • Economics of Test

  • End-to-End Data Analysis

  • Embedded BIST & DFT

  • Emerging Defect Mechanisms

  • Hardware Security and Trust

  • IoT Testing

  • Jitter, High-Speed I/O and RF Test

  • Known-Good-Die testing

  • Memory Test and Repair

  • MEMS Testing

  • Mixed-Signal and Analog Test

  • New Technologies and Test

  • On-Chip Test Compression

  • Online Test

  • Pre- and Post- Silicon Validation

  • Power Issues in Test

  • Protocol-aware Test

  • Reliability and Resilience

  • Scan Based Test

  • SoC/SiP/NoC Test

  • Silicon Debug

  • Simulation and Test

  • System Test (Applications)

  • System Test (Hardware/Software)

  • Test-to-Design Feedback

  • Test Escape Analysis

  • Test Flow Optimizations

  • Test Generation and Validation

  • Test Resource Partitioning

  • Test Standards

  • Test Time Analysis and Reduction

  • Testing High Speed Optics/Photonics

  • Timing Test

  • Yield Analysis and Optimization

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Important Date
  • Conference Date

    Nov 15



    Nov 17


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